SBIR Phase I: Low Cost Natural Graphite Reinforced Copper (Cu-Grp) Composites for Ultra High Thermal Conductivity Electronic Thermal Management Heat Sinks

这个小型企业创新研究第一阶段项目旨在开发极高导热系数散热器，其热膨胀与用于高性能电子和光电系统的先进半导体相匹配。使用低成本的天然石墨片增强，CuGrp复合散热器的导热系数在750至900W/MK之间，同时将热膨胀控制在7至4ppm/K的范围内。这些性能是铜的2到2.5倍，超过了现有的任何与CTE匹配的热管理材料。该项目将产生一系列高性能的被动热管理材料，在不增加复杂性的情况下提高电子和光电系统的性能。这些技术将服务于一个每年以8.5%的速度增长的5亿美元的市场。近期的应用将是用于先进通信的LED和激光二极管制造商的散热器、工业和市政照明以及平板显示器，以及用于先进的雷达MMIC和T/R模块的散热器。由于预计成本较低，其他预期应用包括先进混合动力汽车和电动汽车的电源控制系统以及高性能IGBT基板。该奖项由2009年美国复苏和再投资法案(公法111-5)资助。

This Small Business Innovative Research Phase I project is to develop extremely high thermal conductivity heat sinks that are thermal expansion matched to advanced semiconductors for high performance electronic and electro-optical systems. With low cost natural graphite platelet reinforcement, CuGrp composite heat sinks with thermal conductivities ranging from 750 to 900 W/mK will be achieved while controlling thermal expansion over the range of 7 to 4 ppm/K respectively. These properties are a factor of 2 to 2.5 times Cu and exceed any CTE matched thermal management material available. This project will result in a family of high performance passive thermal management materials that will increase the performance of electronic and electro-optical systems without increasing complexity. These technologies will service an a $500mm market that is growing at a rate of 8.5%/year. Immediate applications will be heat spreaders for LED and laser diode manufacturers for advanced communication, industrial and municipal lighting and flat screen displays as well as heat spreaders for advanced radar MMIC and T/R modules. Because of the projected low cost, other expected applications include power control systems for advanced hybrid and electric powered vehicles as well high performance IGBT base plates.This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).