SBIR Phase II: Ultra High Thermal Conductivity Aluminum/Graphite Composites from Low Cost Natural Graphite

SBIR 第二阶段：低成本天然石墨制成的超高导热铝/石墨复合材料

• 批准号: 0750180
• 负责人: James Cornie
• 金额: --
• 依托单位: Metal Matrix Cast Composites, LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-02-01 至 2010-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0750180&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Ultra; Thermal

The Small Business Innovation Research (SBIR) Phase II project will develop and present for commercialization natural graphite (NG) reinforced Al (AlGr). In this project, inexpensive natural graphite flake (NGF) will be manufactured into a preform and pressure infiltrated with Al-Si alloys to form composites with thermal conductivities (TC) from 600 W/mK to 750 W/mK and corresponding thermal expansion (CTE) from 7 to 4 ppm/K. CTE is specified by controlling volume fraction of NGF. TC is 1.5 to 1.9 times oxygen free high conductivity (OFHC) Cu at 25% of the mass and comparable volumetric cost to Cu with customized CTE enabling thermally efficient direct die attach. High TC results from reaction of Si from the alloy with NGF surfaces to form low thermal impedance SiC interface. These properties result from innovative preform architecture. In addition, quasi-isotropic TC values (~700 W/mK) are achievable through further preform design. For every 10C decrease in operating temperature, the life of an electronic device is doubled. Conversely, more efficient cooling schemes enable devices to be manufactured with higher performance at higher power densities and in smaller spaces. The materials developed in this project would enable such performance enhancements, and at lower cooling costs. The proposed technology would reduce the dependence on copper for electronic thermal management applications and would find serious application in space and military radar and communication systems as well as laser diode heatsinks, heat spreaders for notebook computers and other consumer electronics.

小企业创新研究（SBIR）第二阶段项目将开发和商业化天然石墨（NG）增强铝（AlGr）。 在这个项目中，廉价的天然石墨片（NGF）将被制成预制件，并与铝硅合金压力渗透，形成复合材料的热导率（TC）从600 W/mK到750 W/mK和相应的热膨胀（CTE）从7到4 ppm/K。 通过控制NGF的体积分数来指定CTE。 TC是无氧高导电性（OFHC）Cu的1.5至1.9倍，占质量的25%，体积成本与Cu相当，具有定制的CTE，能够实现热效率高的直接芯片贴装。 高TC是由于合金中Si与NGF表面反应形成低热阻抗SiC界面所致。 这些特性源于创新的预制件结构。 此外，准各向同性TC值（~700 W/mK）可通过进一步的预制件设计实现。 工作温度每降低10摄氏度，电子设备的寿命就会增加一倍。 相反，更有效的冷却方案使设备能够以更高的功率密度和更小的空间制造出更高的性能。 该项目中开发的材料将实现这种性能增强，并降低冷却成本。 拟议的技术将减少电子热管理应用对铜的依赖，并将在空间和军事雷达和通信系统以及激光二极管散热器、笔记本电脑和其他消费电子产品的散热器中得到认真的应用。