SBIR Phase I: Nanocomposites for Electronic Packaging

这个小型企业创新研究第一阶段项目将探索使用分散良好的高导热纳米晶作为功能填料的可行性，以在不牺牲加工性的情况下改善电子封装材料的热性能和机械性能。纳米复合材料的成功开发将确保先进的封装技术能够面对未来几代芯片和电路的挑战。这些纳米复合材料的主要竞争对手将是传统的填料增强复合材料和碳纳米管增强复合材料。该SBIR项目的成功还将推动宽带BaP半导体材料合成的技术水平的提高。这些材料具有独特的机械、光学和电学性能，将应用于许多不同的领域，如光刻、光电探测器和发光二极管。该奖项由2009年美国复苏和再投资法案(公共法律111-5)资助。

This Small Business Innovation Research Phase I project will explore the feasibility of using well dispersed nanocrystals with high thermal conductivity as functional fillers to improve the thermal and mechanical properties of electronic packaging materials without sacrificing processibility. The successful development of nanocomposites will ensure that advanced packaging technology is capable of facing the challenges from the future generations of chips and circuits. The main competitors for these nanocomposites will be traditional filler reinforced composites, and carbon nanotube reinforced composites. The success of this SBIR project will also advance the state of the art in the synthesis of wide band bap semiconductor materials. These materials have unique mechanical, optical and electrical properties, which will be applied in many different areas, such as lithography, photodetectors, and light emitting diodes.This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).