STTR Phase II: Nanoscale Silver Pastes for Low-Temperature Joining of Power Semiconductor Devices

该奖项是根据2009年《美国复苏和再投资法案》(Public Law 111-5)资助的。这一小型企业技术转让(STTR)第二阶段项目旨在加速用于加入半导体芯片的使能纳米材料的商业化。这种创新材料的独特功能将降低制造在恶劣环境中工作所需的无铅电子产品的制造成本，并具有比最先进技术显著提高的性能和可靠性。这个项目的重点是获取和分享广泛的科学知识，这些知识将降低全球电子制造商迅速实现这种纳米材料大规模生产的风险和障碍。一个成功的项目将对美国的电子制造商产生更广泛的影响。在转向无铅产品方面，美国落后于欧洲和亚洲的竞争对手。这种纳米材料将降低制造复杂性和成本，并将帮助美国制造商在价值近5亿美元的芯片连接材料市场占据相当大的份额。

This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).This Small Business Technology Transfer (STTR) Phase II project aims to accelerate the commercialization of an enabling nanomaterial for joining semiconductor chips. The unique features of this innovative material would reduce the manufacturing cost for making lead-free electronics that are required to work in harsh environments and to possess significantly improved performance and reliability over the state-of-the-art technologies. This project focuses on obtaining and sharing extensive scientific knowledge that will lower the risk and barrier for electronic manufacturers worldwide to rapidly implement this nanomaterial in mass production.The broader impacts of a successful project will be to electronics manufacturers in the United States. The U.S. has fallen behind their European and Asian competitors in the move to lead-free products. This enabling nanomaterial will reduce manufacturing complexity and cost, and will help U.S. manufacturers in capturing a significant share of nearly $500 million-dollar market for chip-attach materials.