EXC 1056: Center for Advancing Electronics Dresden (cfAED)

目前，信息处理以互补金属氧化物半导体(CMOS)技术为主。自20世纪60年代以来，由于集成密度按摩尔定律增长而导致的电子学的进步，建立了一个普遍的预期，即创新周期非常短，具有不断新的应用可能性。事实上，在过去几十年里，电子技术的巨大进步推动了各个应用领域的创新，并极大地塑造了我们今天生活的世界。随着CMOS技术达到原子边界，它越来越无法处理由于收缩(短沟道效应、泄漏等)而对器件行为产生的负面影响，摩尔定律预计将结束。因此，人们普遍认为，电子产品的长期创新不能仅仅基于更高的平面集成密度。相反，必须找到新的方法来应对电子信息处理系统当前和未来的挑战：物理尺寸、速度、能源效率、新功能、自组装/组织、适应性、弹性、成本。目前，在CMOS技术和行业路线图方面仍有改进空间，可持续到2022年。在过去的十年里，新材料取得了重大进展，导致了许多有希望的发现。虽然材料研究还需要继续，但一些发现现在已经到了值得探索潜在应用的器件制造、电路和信息处理系统的地步。由于预计在2020年后不久，CMOS的规模化将结束，行业将不再专注于不断进步的CMOS，而将急切地寻找新的想法。鉴于这两个发展，我们认为，基于大学的研究现在有一个独特的机会，可以将新材料和技术创新的发现与推动电子信息处理超越2020年的潜力结合起来。具体地说，德累斯顿先进电子中心(CfAED)的愿景是，未来的cmos技术将与新技术(增强型cmos)相辅相成，导致不同的体系结构形成高效的信息处理环境。

Information processing is currently dominated by complementary metal oxide semiconductor (CMOS) technology. Since the 1960s the advancements in electronics due to scaling of integration densities along Moores law have established a general expectation for very short innovation cycles with ever-new application possibilities. Indeed, the huge advancement of electronics over the past decades has been the driving force for innovation in various application fields and has significantly shaped the world we live in today. As CMOS technology is reaching atomic boundaries, it increasingly fails to deal with the negative impacts on device behaviour due to shrinkage (short channel effects, leakage etc.), and Moores law is projected to end. Thus, it is accepted that long-term innovation in electronics cannot be based solely on higher planar integration densities. Instead, new ways must be found to address current and future challenges of electronic information processing systems: physical size, speed, energy efficiency, new functionality, self-assembly/-organisation, adaptivity, resilience, cost. Currently, there still is room for improvement in CMOS technology and industry roadmaps reach out to 2022. The past decade has seen significant advances in new materials, which have led to many promising discoveries. While material research needs to continue, some discoveries have now reached a point that warrants exploring device fabrication, circuits and information processing systems for potential applications. As CMOS scaling is projected to end soon after 2020, industry will stop being preoccupied with advancing CMOS and will eagerly look out for new ideas. Given these two developments, we believe that university-based research now has a unique opportunity to integrate discoveries on new materials and technological innovations with the potential for advancing electronic information processing beyond 2020. Specifically, it is the vision of the Center for Advancing Electronics Dresden (cfAED) that future CMOS technology will be complemented with new technologies (augmented CMOS), resulting in heterogeneous architectures to form highly efficient information processing environments.