BRIGE: High-Performance Printable Oxides for Flexible Electronics (HiPPO)

智力优势：基于非晶和多晶硅的透明非晶氧化物半导体是现有晶体管技术的有吸引力的替代品，以实现高性能、柔性和大面积电子器件的未来应用。 喷墨印刷电子产品也需要基于溶液的工艺。该BRIGE项目将使用一种新的分子前体方法研究溶液处理的三元非晶金属氧化物薄膜，如氧化锌锡和氧化锌镓。该研究旨在确定使用这些前体制造薄膜晶体管有源层的可行性，并开发替代能源，以降低高质量薄膜形成所需的温度，为各种电子，光电和磁性薄膜的未来溶液加工打开大门。这些薄膜的半导体物理，如缺陷和捐助者的性质，以及电子电荷传输，将进行探讨。最后，该项目旨在展示该薄膜在未来广泛的电路应用中的潜力。更广泛的影响：拟议的可印刷柔性电子产品技术工作有可能对消费者、工业和军事移动的应用技术产生重大影响，这些应用的关键设计标准是耐用性、低重量和低成本。该项目将在教育和培训方面产生广泛的影响，使本科生和研究生研究人员与PI一起进行合作研究。学生将获得与电子材料和设备的微纳米制造相关的制造和表征技术的重要经验，并将寻求通过推广计划与更广泛的社区（包括学龄学生）分享他们的知识。工程研究的参与将通过招聘，培训，指导和推广到各级代表性不足和残疾学生扩大。

Intellectual Merit: Transparent amorphous oxide semiconductors based on amorphous and poly-silicon are an attractive alternative to existing transistor technologies to enable future applications of high-performance, flexible and large-area electronics. Solution-based processes are also needed for ink-jet printable electronics. This BRIGE project will study solution-processed ternary amorphous metal oxide thin films such as zinc tin oxide and zinc gallium oxide using a novel molecular precursor approach. The research seeks to establish the feasibility of using these precursors to fabricate the active layer of thin film transistors and to develop alternate energetic sources to lower the required temperature for high-quality film formation, opening the door to future solution processing of a variety of electronic, optoelectronic and magnetic thin films. The semiconductor physics of these films, such as the nature of defects and donors as well as electronic charge transport, will be explored. Finally, this project seeks to demonstrate the films' potential for future applications in a wide range of demanding circuit applications.Broader Impacts: The proposed technical work on printable, flexible electronics has the potential to significantly impact technologies for consumer, industrial, and military mobile applications where durability, low weight and low-cost are key design criteria. The project will have broad impact in education and training by involving both undergraduate and graduate researchers in collaborative research alongside the PI. The students will obtain significant experience in fabrication and characterization techniques relevant to micro- and nano-fabrication of electronic materials and devices, and will seek to share their knowledge with the broader community, including school-age students, via outreach programs. Participation in engineering research will be broadened through recruiting, training, mentoring, and outreach to under-represented and disabled students at all levels.