MRI: Acquisition of Precision Wafer Aligner and Bonder for Research, Education, and Training in 3-D Micro- and Nano- Mechanical, Electrical and Optical Systems
MRI: Acquisition of Precision Wafer Aligner and Bonder for Research, Education, and Training in 3-D Micro- and Nano- Mechanical, Electrical and Optical Systems
批准号:
1126077
负责人:
Kevin Turner
金额:
$40.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2011
资助国家:
美国
项目状态:
已结题
起止时间:
2011-09-01 至 2013-08-31
中文摘要
这项主要研究仪器(MRI)拨款支持晶圆对准器和键合系统的采购,该系统将放置在宾夕法尼亚大学的共享用户纳米制造设施中。排列晶圆键合技术提供了精确堆叠和连接多个半导体衬底的能力,以实现新型微纳米器件。该技术通过允许将各种材料和厚度的有图案或无图案的晶圆粘合在一起,极大地扩展了基于光刻、沉积和蚀刻的传统微制造工艺的能力。因此,该技术使3D微机电系统(MEMS)、微流体平台、3D集成电路和光学器件的制造成为可能。晶圆键合系统将允许使用几个重要工艺对大直径基板进行精确的横向对准和键合,包括直接,阳极,玻璃熔块,金属和聚合物键合。晶圆对准器和键合器的收购将增强在多个领域的研究能力,包括微机械设备,小型流体系统,以及纳米电子和光学系统的制造。这种晶圆对准器和键合系统将广泛影响各种学生和研究人员的研究和培训。宾夕法尼亚大学的用户以及周边地区许多其他学术机构的用户以及工业界的用户都可以访问纳米制造设施中的工具。此外,制造设备用于本科生的高级项目和本科研究,以及来自许多不同学术部门的研究生和博士后,他们中的许多人将使用所要求的仪器。因此,该工具将为开发前沿小型设备的广泛用户提供增强的微纳米制造能力。
英文摘要
This Major Research Instrumentation (MRI) grant supports the acquisition of a wafer aligner and bonder system that will be placed in a shared user nanofabrication facility at the University of Pennsylvania. Aligned wafer bonding technology provides the ability to precisely stack and join multiple semiconductor substrates to realize new types of micro- and nano-devices. The technology significantly expands the capability of traditional microfabrication processes based on lithography, deposition, and etching by allowing wafers of various materials and thicknesses that are either patterned or unpatterned to be bonded together. As a result, the technology enables the fabrication of 3D microelectromechanical systems (MEMS), microfluidic platforms, and 3D integrated circuits and optical devices. The wafer bonding system will allow for the precise lateral alignment and bonding of large diameter substrates using several important processes, including direct, anodic, glass-frit, metal, and polymer bonding. The acquisition of the wafer aligner and bonder will enhance research capability in multiple areas, including micromechanical devices, small-scale fluidic systems, and the manufacturing of nanoelectronic and optical systems. This wafer aligner and bonder system will broadly impact both the research and training of a diverse body of students and researchers. Tools in the nanofabrication facility can be accessed by users from the University of Pennsylvania as well as users from other academic institutions, of which there are many in the surrounding region, and users from industry. Furthermore, the fabrication facility is used by undergraduate students in their senior projects and in their undergraduate research, as well as graduate students and postdocs from many different academic departments, many of whom will make use of the requested instrumentation. Thus, the tool will provide access to enhanced micro- and nano-manufacturing capability for a broad range of users developing leading edge small-scale devices.
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会议论文
Conference: 2023 Gordon Research Conference and Seminar on the Science of Adhesion; South Hadley, Massachusetts; 23-28 July 2023
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批准号:2314214
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项目类别:Standard Grant
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资助金额:$1.95万
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财政年份:2023
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负责人:Kevin Turner
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依托单位:
NRI: INT: COLLAB: Soft Active Contact Pads with Tunable Stiffness and Adhesion for Customizable Robotic Grasping
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批准号:1830475
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项目类别:Standard Grant
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资助金额:$37.2万
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财政年份:2018
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负责人:Kevin Turner
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依托单位:
Collaborative Research: Exploiting Tunable Stiffness for Dynamic Adhesion Control at the Macro- and Micro-Scale
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批准号:1663037
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项目类别:Standard Grant
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资助金额:$26.9万
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财政年份:2017
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负责人:Kevin Turner
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依托单位:
GOALI/Collaborative Research: Manufacturing of Carbon Nanotube Contacts for High-Performance Microelectromechanical Switches
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批准号:1463344
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项目类别:Standard Grant
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资助金额:$17.5万
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财政年份:2015
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负责人:Kevin Turner
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依托单位:
Structured Composite Materials with Variable Adhesion Properties
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批准号:1435745
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项目类别:Standard Grant
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资助金额:$37.13万
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财政年份:2014
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负责人:Kevin Turner
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依托单位:
海外基金