22nd Annual Workshop on Interconnections within High-speed Digital Systems: Support for Student Participation, May 8-11, 2011 Santa Fe, NM.

这项活动的目的是为来自美国大学的五名学生提供支持，让他们参加第22届IEEE/LEOS关于高速数字系统中的互连的年度研讨会，并参与学术海报会议。研讨会将于2011年5月8日至5月11日在新墨西哥州圣达菲的Eldorado Hotel&Amp；Spa举行。研讨会的议程包括教程、特邀演讲、互动问题解决会议和学术海报会议。智力价值：数据流量的指数增长以及对高比特率通信和电子服务不断增长的需求，加速了互联技术领域的研究和开发。计算模式向并行多核处理的转变需要一种集成的设计方法，以解决网络、通信和高性能计算中从芯片级到系统级架构的互连瓶颈。该研讨会汇集了来自不同领域的关键研究人员和行业专家，包括半导体设备、计算架构和算法、3D封装和光电集成，从而解决了这些互连挑战的多学科性质。学术海报会议包括一些精选的高质量学生论文的投稿。布罗德影响：这次研讨会将对高速互连技术产生重大影响，讨论打破计算网络和通信系统带宽瓶颈的新方法。来自美国的初级研究人员，包括研究生和博士后，将受益于跨学科和互动研讨会的形式，培训他们提供下一代高性能互联解决方案。讲习班通过与学术组织和为少数群体服务的机构的互动，包括一个强有力的外展部分。

The objective of this activity is to provide support for five students from U.S. universities to attend the 22nd Annual IEEE/LEOS Workshop on Interconnections within High-Speed Digital Systems and participate in the academic poster session. The workshop will be held May 8 - May 11, 2011 at the Eldorado Hotel & Spa in Santa Fe, New Mexico. The workshop agenda includes tutorials, invited talks, interactive problem solving sessions, and an academic poster session.Intellectual Merit: The exponential growth in data traffic and ever increasing demand for high bit-rate communications and e-services has accelerated research and development in the area of interconnection technology. The paradigm shift in computing towards parallel multicore processing requires an integrated design approach to address interconnect bottlenecks from chip-scale to system-scale architectures in networking, communications, and high performance computing. This workshop addresses the multi-disciplinary nature of these interconnection challenges by bringing together key researchers and industry experts from a variety of fields, including semiconductor devices, computing architectures and algorithms, 3D packaging, and opto-electronic integration. An academic poster session includes contributions from a selected number of high quality student papers.Broader Impacts: This workshop will have significant impact on high-speed interconnection technology discussing novel approaches to break bandwidth bottlenecks in computing networks and communication systems. Junior researchers from the U.S., including graduate students and post-docs, will benefit from the interdisciplinary and interactive workshop format, training them to provide the next generation of high performance interconnection solutions. The workshop includes a strong outreach component through interactions with academic organizations and minority-serving institutions.