GOALI: Thermal Transport by Phonons in Device-Grade Nitride Nanostructures
GOALI: Thermal Transport by Phonons in Device-Grade Nitride Nanostructures
批准号:
1133394
负责人:
Jonathan Malen
金额:
$39.53万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2011
资助国家:
美国
项目状态:
已结题
起止时间:
2011-09-01 至 2014-08-31
中文摘要
项目负责人:Jonathan a . malen提案号:1133339氮基半导体是用于固态照明、高频/电力电子和未来多结光伏的发光二极管(led)的核心。这些技术的商业化进程需要高电流密度,这迫使改进热管理以降低操作温度。虽然封装策略改善了散热,但初步数据显示,器件本身具有很大的热阻。器件级氮化膜的热导率(k)测量表明,在100nm的氮化铝(AlN)和100nm的氮化镓(GaN)薄层中,k值非常低。电子显微镜图像显示,这些减少是由工业生长过程中固有的结构缺陷引起的。到目前为止,还缺乏一个明确的科学解释。智力优势:这一GOALI提案的目标是研究由GaN, AlN和铟镓氮化(InGaN)薄膜(~100nm)组成的氮化半导体异质结构中的热输运,这些薄膜是通过可扩展生长工艺制备的。卡内基梅隆大学(CMU)的一个跨学科学术研究小组与Kyma Technologies合作,将研究氮化物纳米结构中声子热传输的本质。有缺陷的薄膜和界面由与体声子平均自由路径相称的距离分开,将被考虑。开放的科学问题包括:器件-衬底界面和氮化物层之间的热边界电阻(R)是多少?高度缺陷的晶体能像无序的材料一样传递热量吗?生长技术如何影响薄膜的热性能?为了回答这些问题,研究将集中在一种常见的基底结构上,包括蓝宝石、碳化硅或GaN衬底,衬底上有AlN成核层,然后是InGaN缓冲层。具体研究包括:(i)衬底对AlN成核层R和k的影响,(ii)生长技术对AlN成核层k和R的影响,以及(iii)铟浓度对InGaN缓冲层k和R的影响。氮化物的受控生长和缺陷密度和结构的成像(Davis, Paskova)将用于分子动力学模拟的原子结构(mcgoghey)。模拟结果将与这些样品上k和R的直接测量结果进行比较,这些样品使用称为频域热反射(Malen)的泵浦探针光学方法进行测量。更广泛的影响:与Kyma Technologies的合作使这项研究可以直接转移到工业中,在工业中,氮化器件有可能彻底改变照明并优于硅基电子产品。Kyma认识到将热管理纳入氮化物器件结构的迫切需要。Kyma的生长技术代表了氮化物的未来,获得这些技术将使任何发现意义深远。与Cree公司和海军研究实验室在氮化物科学和技术方面的持续合作进一步支持了这项研究的需要。这些教育活动将通过课程开发、客座讲座和研讨会以及在Kyma的暑期实习,让学生接触到行业驱动的学术研究。Kyma,反过来,将通过整合学术pi教授的课程中的研究课题和成果,在CMU获得曝光。一项基于led的外展活动“照明:下一代”将为女性工程师协会高中日、匹兹堡公立学校和基督教女青年会技术女孩计划开发。
英文摘要
PI: Jonathan A. MalenProposal Number: 1133394Nitride-based semiconductors are a centerpiece of light-emitting diodes (LEDs) for solid-state lighting, select high-frequency/power electronics, and future multi-junction photovoltaics. Progress towards commercialization of these technologies demands high current densities that compel improved thermal management to lower operating temperatures. While packaging strategies improve heat dissipation, preliminary data show that the device itself has a large thermal resistance. Thermal conductivity (k) measurements on device-grade nitride films show very low values of k in thin 100nm aluminum nitride (AlN) and 100nm gallium nitride (GaN) layers. Electron microscopy images suggest that these reductions are caused by structural imperfections inherent to industrial growth processes. As yet, a clear scientific explanation is lacking.Intellectual Merit: The objective of this GOALI proposal is to study thermal transport in nitride semiconductor heterostructures composed of GaN, AlN, and indium gallium nitride (InGaN) thin films (~100nm), fabricated by scalable growth processes. An interdisciplinary team of academic investigators at Carnegie Mellon University (CMU), in partnership with Kyma Technologies, will study the nature of thermal transport by phonons in nitride nanostructures. Defective films and interfaces separated by distances commensurate to the bulk phonon mean free paths will be considered. Open scientific questions include: What is the thermal boundary resistance (R) at the device-substrate interface and between nitride layers? Can highly defective crystals transport heat in a manner similar to disordered materials? How do growth techniques impact thin film thermal properties?To answer these questions, the investigation will focus on a common base structure that includes a sapphire, silicon carbide, or GaN substrate with an AlN nucleation layer followed by an InGaN buffer layer. Specific inquiries include: (i) the effect of the substrate on R and k of the AlN nucleation layer, (ii) the effect of growth technique on k and R of the AlN nucleation layer, and (iii) the effect of indium concentration on k and R of the InGaN buffer layer. Controlled growth of nitrides and imaging of defect density and structure (Davis, Paskova) will be used to inform the atomic structure for molecular dynamics simulations (McGaughey). Simulation results will be compared with direct measurements of k and R on these samples, made using a pump-probe optical method called Frequency Domain Thermoreflectance (Malen).Broader Impact: Partnership with Kyma Technologies makes this research directly transferable to industry, where nitride devices have the potential to revolutionize lighting and to outperform silicon-based electronics. Kyma recognizes the critical need for incorporating thermal-management into the nitride device structure. Access to Kyma's growth technologies, which represent the future of nitrides, will make any discoveries far-reaching. Continuing collaborations on nitride science and technology with the Cree Corporation and the Naval Research Laboratory further support the need for this research. The educational activities will expose students to industry-driven academic research through curriculum development, guest lectures and seminars, and summer internships at Kyma. Kyma, in turn, will receive exposure at CMU through integration of the research topics and results within courses taught by the academic PIs. An LED-based outreach activity "Lighting: The Next Generation" will be developed for the Society of Women Engineers High School Day, Pittsburgh public schools, and the YWCA TechGyrls program.
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