SBIR Phase I: Scale-up Flexible Radio Frequency Electronics via Roll-to-Roll Nanomembrane Printing

这个小企业创新研究（SBIR）第一阶段项目旨在开发基于晶体纳米膜卷对卷印刷工艺的具有成本效益的高性能柔性射频（RF）电子产品。这种柔性电子系统可以同时展示高速（5ghz）、高可靠性和高一致性/灵活性，具有非常简化、高产量和低成本的材料集成和组装过程。通常用于聚合物和非晶硅基柔性电子制造的连续卷对卷印刷工艺将用于晶体半导体，晶体半导体通常在高性能小型化电子产品的刚性衬底上进行批量加工。该项目的更广泛/商业影响将是提供具有成本效益的高速柔性/保形电子和射频集成电路的潜力，这对于广泛的市场应用非常理想，包括相控阵天线，保形通信/监视系统，可穿戴电子产品，高性能柔性传感器和高分辨率/低功耗柔性成像/显示系统。这项技术有望弥合高性能刚性电子产品和低成本柔性电子产品之间的差距，为高速柔性射频电子产品提供独特的产品。卷对卷印刷工艺还将使晶体半导体纳米膜的生产和制造规模扩大，用于具有成本效益的柔性射频电子和光子学。

This Small Business Innovation Research (SBIR) Phase I project aims to develop cost-effective high-performance flexible radio frequency (RF) electronics based on a crystalline nanomembrane roll-to-roll printing process. Such flexible electronic systems can concurrently demonstrate high speed (5 GHz), high reliability and high conformability/flexibility, with much simplified, high-yield, and low-cost material integration and assembly processes. Continuous roll-to-roll printing processes, which are commonly used for polymer and amorphous silicon based flexible electronics manufacturing, will be developed for crystalline semiconductors, which are typically batch processed on rigid substrates for high-performance miniaturized electronics. The broader/commercial impact of this project will be the potential to offer cost-effective, high-speed flexible/conformal electronics and integrated circuits at RF frequency, which are highly desirable for a wide range of market applications, including phased array antennas, conformal communication/surveillance systems, wearable electronics, high-performance flexible sensors, and high resolution/low power consumption flexible imaging/display systems. This technology is expected to bridge the gap between high-performance rigid electronics and low-cost flexible electronics, offering a unique product for high-speed flexible RF electronics. The roll-to-roll printing process will also enable scale-up production and manufacturing of crystalline semiconductor nanomembranes for cost-effective flexible RF electronics and photonics.