Small-Business ERC Collaborative Opportunity Package Prototyping of the Environment Resistant Package (ERP) with commercial Inertial Sensor and Oscillator Companies
Small-Business ERC Collaborative Opportunity Package Prototyping of the Environment Resistant Package (ERP) with commercial Inertial Sensor and Oscillator Companies
批准号:
1246145
负责人:
Jay Mitchell
金额:
$20.0万
依托单位:
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2012
资助国家:
美国
项目状态:
已结题
起止时间:
2012-10-01 至 2014-12-31
中文摘要
这项小型企业/ ERC合作机会(SECO)资助将帮助ePack公司将环境抗性封装(ERP)商业化,这是无线集成微系统(WIMS)工程研究中心(ERC)开发的一种平台技术。微传感器(以及许多其他电子元件)很脆弱,对环境中的颗粒、湿度、振动、冲击和温度变化很敏感。因此,封装是在实际应用中保护这些设备并因此实现商业化的关键因素。事实上,封装是新型微机电系统(MEMS)商业化的最大限制因素之一。这就是为什么ePack成立,然后在2010年从密歇根大学的WIMS-ERC完全剥离出来,并拥有ERP技术专利的独家许可。ERP技术使真空包装,隔振和设备的低功率烤箱控制。这项SECO拨款的目的是在ERP中建立商用惯性传感器和振荡器的原型,以证明在几个不同的应用领域中提高了10 / 100倍的抗振性或温度稳定性(从而提高了性能水平)。更广泛的影响(该技术的应用)这将使下一代具有成本效益,高性能和高可靠性的应用,包括:消防员和部队的手持导航系统;用于警察、军事和商业应用的无人驾驶飞行器导航;工业机器人运动控制;商用卡车和小型喷气式飞机的移动宽带。
英文摘要
AbstractThis Small-Business/ ERC Collaborative Opportunity (SECO) grant will help ePack, Inc., commercialize the Environmental Resistant Package (ERP), which is a platform technology developed in the Wireless Integrated Microsystems (WIMS) Engineering Research Center (ERC). Microsensors (as well as many other electronic components) are fragile and sensitive to particles moisture, vibration, shock and temperature changes in the environment. Packaging therefore is a key factor for protecting these device in real world applications and therefore for their commercialization. In fact, packaging is one of the biggest limiting factors for the commercialization of new microelectromechanical systems (MEMS).This is why ePack was founded and then fully spun out of the WIMS-ERC at the University of Michigan (U of M) in 2010 and has an exclusive license for the patent on the ERP technology. The ERP technology enables vacuum packaging, vibration isolation and low power oven control of devices. The purpose of this SECO grant is to prototype commercial inertial sensors and oscillators in the ERP in order to demonstrate 10 / 100 times improved vibration resistance or temperature stability (and therefore that level of improved performance) in several different application areas.Broader Impact (Applications of the Technology)This will enable a next generation of cost efficient, high performance and high reliability applications including: handheld navigation systems for firefighters and troops; navigation of unmanned air vehicles for police, military and commercial applications; motion control for industrial robots; and mobile broadband for commercial trucks and small jets.
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会议论文
SBIR Phase I: A Universal Wafer-Level Capping Process for MEMS and Microdevices
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批准号:0945795
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项目类别:Standard Grant
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资助金额:$0.0万
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财政年份:2010
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负责人:Jay Mitchell
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依托单位:
海外基金