Test and Simulation

在项目MUSIK的第一阶段中获得的单个MEMS部件的结果被包括在第二阶段的总系统方法中。它将研究MEMS元件用于功率应用（如传输路径）的可能性，但也关注空间集成的寄生耦合等问题，这些问题与整个系统的功能有关。B3部分在MUSIK第2阶段的任务是扩展第1阶段开发的MEMS元件参数模型，这些模型适用于SiCer复合衬底，例如纵向模式MEMS谐振器（LMR）或开关结构，特别是热效应和非线性特性，由建模和有限元模拟以及测量测试支持。选定的工作包地址，除其他外，建模的MEMS开关的电源应用，以及发生的机械损耗和耦合的RF-MEMS谐振器。基于这些研究，开发了紧凑的参数化行为模型，用于与A1和A2部分合作的高级系统仿真和优化。在其他工作包中，通过激光多普勒振动测量也支持对力学模型的验证。

The results obtained in the first phase of the project MUSIK for individual MEMS components are included in the total system approach in the second phase. It will be investigated the possibilities of MEMS components for power applications such as a transmission path, but also issues such as parasitic coupling by spatial integration, which relate to the functioning of the overall system, are in focus.Part B3 has in Phase 2 of MUSIK the task to expand the developed parametric models for MEMS components from Phase 1, that are adapted to the SiCer composite substrate, such as longitudinal mode MEMS resonators (LMR), or switch structures, in particular to thermal effects and non-linear properties, supported by modeling and finite element simulations and measurement tests. Selected work packages address, inter alia, the modeling of MEMS switches for power applications as well as the occurring mechanical losses and coupling in RF-MEMS resonators. Based on these studies, compact parameterized behavioral models are developed for use in an advanced system simulation and optimization in cooperation with the Parts A1 and A2. The verification of the mechanical models is also supported in other work packages by laser Doppler vibrometry measurements.