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SBIR Phase I: Diamagnetically Directed Self-Assembly of Light Emitting Diodes for Fabricating Large Area, Direct View Displays

SBIR Phase I: Diamagnetically Directed Self-Assembly of Light Emitting Diodes for Fabricating Large Area, Direct View Displays
SBIR 第一阶段:用于制造大面积直视显示器的发光二极管的反磁性定向自组装
批准号:
1621960
负责人:
Mark Durniak
金额:
$22.5万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2016
资助国家:
美国
项目状态:
已结题
起止时间:
2016-07-01 至 2017-06-30

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中文摘要
翻译
这个小型企业创新研究(SBIR)第一阶段项目的更广泛的影响/商业潜力是使颠覆性的发光二极管(LED)组装技术更接近商业化,并能够创建一个变革性的低成本制造平台,以制造未来高效的高分辨率LED显示屏以及其他复杂的集成电子系统。该项目的成功将彻底改变大面积LED阵列组件制造,从而显著提高显示质量,同时大幅降低显示能耗,就像高效LED大幅降低照明系统能耗一样。直观型全LED显示屏提供上级观看质量和高分辨率,与当前的LCD和OLED技术相比可显著节省能源。对于越来越高分辨率的信息显示器存在巨大的需求,但是LED显示器制造商在LED封装中面临非常高的成本。 这种新的LED组装技术可以大幅降低LED封装成本一个数量级的极高品质的LED显示屏。该技术还可以扩展到在系统的大面积基板上组装任何其他类型的小型半导体芯片组件,例如太阳能系统,柔性电子产品和分布式网络电子表面。这个小型企业创新研究(SBIR)第一阶段项目将开发并帮助商业化一种全新的技术,用于高速,高精度组装小型LED,用于制造节能,高性能直观式发光二极管(LED)显示器。这项正在申请专利的技术克服了现有的拾取和放置技术和目前正在开发的晶圆级冲压技术的局限性。这种组装工具相当简单和便宜,同时实现了几乎任何LED尺寸,像素间距和显示器尺寸的更高组装率。该项目的目标是通过具有良好特征的基线工艺证明这一技术的商业化可行性。将为未来的产品开发建立一套过程度量和缩放规则。该项目将产生一个原型装配系统和一个LED显示屏演示,以展示该技术对LED显示屏制造业的价值主张。
英文摘要
The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project is to bring a disruptive Light Emitting Diode (LED) assembly technology closer to commercialization and enable the creation of a transformative, low cost manufacturing platform needed to manufacture future efficient high resolution LED displays as well as other complex integrated electronic systems. This project's success will revolutionize large-area LED array assembly manufacturing, leading to significant improvements in display quality, while achieving large reductions in display energy consumption, just as high efficiency LEDs have dramatically reduced energy consumption in lighting systems. Direct view all-LED displays offer superior viewing quality and high resolution at significant energy savings over current LCD and OLED technologies. There is a huge demand for information displays of increasing higher resolution, but LED display manufacturers face a very high cost in LED packaging. This new LED assembly technology can drastically reduce the LED packaging cost by an order of magnitude for extremely high quality LED displays. This technology can also be extended to the assembly of any other types of small semiconductor die components on large area substrates for systems, such as solar systems, flexible electronics, and distributed networked electronic surfaces.This Small Business Innovation Research (SBIR) Phase I project will develop and help commercialize a radically new technology for high speed, high precision assembly of small LEDs for manufacturing energy efficient, high performance direct view Light Emitting Diode (LED) displays. This patent-pending technology overcomes the limitations of incumbent pick-and-place technologies and wafer-scale stamping technologies currently in development. This assembly tool is considerably simpler and less expensive, while achieving much higher assembly rates for almost any LED size, pixel pitch and display dimensions. The objective of this project is to demonstrate the commercialization viability of this technology with well characterized baseline processes. A set of process metrics and scaling rules will be established for future product development. This project will result in a prototype assembly system and a LED display demo to demonstrate the value proposition of this technology for the LED display manufacturing industry.
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