Reactive wetting of solid-liquid interfaces in the Au-Sn alloy system

在许多技术上相关的过程中，例如焊接、焊接或烧结，金属合金固-液界面的润湿过程决定了粘结的机械性能。由于在技术应用中没有足够的工具来预测润湿过程，我们的目标是在这个项目中获得对界面形成的理解。相场法的设想扩展将允许在介观尺度上对毛细管力、对流和扩散过程以及界面的动态演变进行3D模拟。通过建立与温度和浓度相关的材料性质的适当公式，以金-锡为例，分析了反应润湿。模拟所需的热物理性质将在平行实验中确定。此外，将计算的接触角、浓度分布和液滴形状与实验结果进行了比较，为相场法的验证和优化提供了参考。

In numerous technically relevant processes as, for instance, soldering, welding, or sintering, the course of of wetting processes at solid-liquid interfaces of metallic alloys determines the mechanical properties of the bond. As there is no sufficient tool for the prediction of wetting processes in technical applications, we aim to obtain an understanding of interface formation in this project. The envisaged extension of the phase field method will allow a 3D simulation of the dynamic evolution of capillary forces, convective and diffusive processes, and interfaces on a mesoscopic scale. By suitable formulation of temperature and concentration dependent material properties, reactive wetting is to be analyzed on the example of Au-Sn. Thermophysical properties, needed for the simulation, will be determined in parallel experiments. In addition, the comparison of calculated contact angles, concentration profiles, and droplet shapes with those experimentally obtained will provide a reference for the validation and optimization of the phase field method.