SBIR Phase I: IoT2:IoT Energy and Power Systems

这个小型企业创新研究（SBIR）第一阶段项目的更广泛的影响/商业潜力将是展示一种将能量收集技术集成到标准电子电路中的新方法。这为在偏远地区生产小型传感器和设备提供了机会，这些传感器和设备可以收集信息，监控条件并传输数据，而无需更换电池。小型电池不适用于远程部署的电子设备，从而推动了直接从机械的运动和振动中获取电能的兴趣。目前，能量收集对于实际部署来说太大、昂贵且效率低下。如果能量收集可以做得小而便宜，它可以为工业，民用和农业远程监控提供大量的产品和服务。该项目提供了将能量收集到电子设备中的潜力，可以从振动或移动机械中高效转换能量，同时保持小尺寸和低成本。将微小的运动部件直接嵌入印刷电路的能力是高度创新的，动态能量收集是这项技术的一个很好的应用。该专利制造工艺可以使用国内电子制造基础设施进行，有助于将下一代制造业带到美国。该项目旨在展示一种新的方法，将动态能量收集设备直接嵌入印刷电路板，以低成本和小尺寸实现微能源生产。该项目建立在专利的制造工艺，利用传统的电子制造基础设施？可以构建具有微米级特征尺寸的器件，而不需要昂贵的硅制造铸造厂。该项目将探索小型高效振动装置的设计和制造工艺，最终在单个小尺寸电路板上生产多个设备。将大力发展小型、高效的振动单元，这些振动单元可以廉价、大量地制造，但可以直接嵌入印刷电路中。预计将进行三轮生产，生产出可以进行实验测试和测量的真实的设备。该项目的成功完成将展示在一个小型印刷电路板（大约信用卡大小）中产生的电能，目标是100微瓦，为传感和遥测电子设备供电。

The broader impact/commercial potential of this Small Business Innovation Research (SBIR) Phase I project will be to demonstrate a new way of integrating energy harvesting technologies in standard electronic circuits. This offers the opportunity to produce small sensors and devices in remote locations that can collect information, monitor conditions, and transmit data without the need to replace batteries. Small batteries are unsuitable for electronics that are remotely deployed, driving interest to harvest electrical energy directly from the movement and vibration of machinery. Currently, energy harvesting is too large, expensive, and inefficient for practical deployment. If energy harvesting can be made small and inexpensive, it can enable a large suite of products and services for industrial, civil, and agricultural remote monitoring. This project offers the potential to bring energy harvesting to electronics in a way that allows highly efficient energy conversion from vibrating or moving machinery, while maintaining small size and low cost. The ability to embed tiny moving parts directly within printed circuits is highly innovative, and dynamic energy harvesting is an excellent application of this technology. The patented manufacturing processes can be performed using domestic electronics manufacturing infrastructure helping to bring next-generation manufacturing to the U.S.The proposed project seeks to demonstrate a new way to embed dynamic energy harvesting devices directly within printed circuit boards, enabling micro energy production at low cost and small size. The project builds on patented manufacturing processes that leverages conventional electronics manufacturing infrastructure?devices can be built having feature sizes in microns without the need for expensive silicon fabrication foundries. The project will explore designs and fabrication processes for small, efficient vibrating units, culminating in the production of multiple devices in a single small footprint circuit board. Significant effort will be on the development of small, efficient vibrating units that can be manufactured cheaply and in large quantities, yet embedded directly within printed circuits. Three manufacturing rounds are anticipated, producing real devices that can be experimentally tested and measured. The successful completion of this project will demonstrate electrical energy production in a small printed circuit board (approximately the size of a credit card), targeting 100 microwatts to power sensing and telemetry electronics.