13th International Conference on the Technology of Plasticity (ICTP 2020); Columbus, Ohio; July 26-31, 2020

该奖项支持美国机构的25名学生和15名博士后研究人员参加将于2020年7月26日至31日在俄亥俄州州立大学举行的第十三届塑性技术国际会议（ICTP 2020）。 ICTP 2020由冶金学会（TMS）主办。将汇集来自世界各地的研究人员，专业人士和工程师，讨论金属成形技术和科学的所有主要领域的改进和创新。该奖项为年轻研究人员提供了与来自世界各地工业和政府机构的领先研究人员和工程师以及国内和国际工程学院的学生和教师交流思想的机会。除了培养全球制造业的愿景外，参与者还将学习金属成形的最新研究领域和成果。ICTP 2020的主题领域将包括与传统领域有关的会议，如金属成形工艺，变形连接，以及成形的微观结构表征和发展，还将包括一些创新，前瞻性主题的会议，如大数据和人工智能在金属成形中的作用，以及敏捷金属成形和高速脉冲成形技术的出现，以加速创新。申请的资金将用于为年轻研究人员提供参与者支持。 将大力鼓励代表性不足的群体申请，并将为来自任何一所大学或组织的不超过三名个人提供支持，以鼓励所代表的机构之间的多样性。此外，还将向一些应邀的主旨发言人提供援助，以采购预计将吸引50多名早期职业演讲人参加的海报展示会所需的用品，并支付制作和印刷会议记录的部分费用。 与会者将完成一项调查，以确定最受欢迎的会议和计划的方面，这将使未来的会议，以扩大主题的重点或覆盖新的领域，没有探索。这个奖项反映了NSF的法定使命，并已被认为是值得通过评估使用基金会的知识价值和更广泛的影响审查标准的支持。

This award supports up to 25 students and 15 postdoctoral researchers at US institutions to participate in the Thirteenth International Conference on the Technology of Plasticity (ICTP2020), to be held at The Ohio State University on July 26-31, 2020. The ICTP 2020, sponsored by the Metallurgical Society (TMS). will bring together researchers, professionals, and engineers from around the world to discuss improvements and innovations in all major areas of the technology and science of metal forming. The award provides young researchers with opportunities to exchange ideas with leading researchers and engineers from worldwide industrial and governmental facilities, as well as with students and faculty from both domestic and international engineering schools. In addition to nurturing a global manufacturing vision, participants will learn the latest research areas and results in metal forming. Topical areas at the ICTP2020 will include sessions concerned with traditional fields, such metal forming processes, joining by deformation, and microstructure characterization and development by forming, and will also include a number of sessions on innovative, forward-looking topics, such as the role of Big Data and Artificial Intelligence in metal forming, and the emergence of agile metal forming and high-speed impulse forming techniques and technologies to speed innovations. Requested funds will be used to provide participant support for young researchers. Underrepresented groups will be strongly encouraged to apply and support will be provided to no more than three individuals from any one university or organization to encourage diversity among the institutions represented. In addition, assistance awards will be provided to some invited keynote speakers, to procure supplies needed for the poster session, which is anticipated to draw over 50 early career presenters, and to partially defray the cost of producing and printing the conference proceedings. Attendees will complete a survey to determine the most popular sessions and aspects of the program that will allow future conferences to expand the topic focus or cover new areas that were not explored.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.