Development of thermoplastic-compatible piezoceramic modules (TPM) and corresponding production processes (A05)

子项目A05的目标是热塑性兼容压电陶瓷模块（TPM）的系统开发和技术实现，其功能化的热塑性载体膜已经与要集成的碳或玻璃纤维增强热塑性复合材料结构的基体材料相匹配。由于热塑性基体组件的熔融性是确定的，因此在热塑性复合材料结构的制造过程中，可以在功能模块和复合材料结构之间产生均匀的连接，从而省去了粘合剂粘合组装步骤。

Aim of subproject A05 is the systematic development and technological implementation of thermoplastic-compatible piezoceramic modules (TPM), whose functionalized thermoplastic carrier film is already matched to the matrix material of carbon or glass fiber reinforced thermoplastic composite structure to be integrated in. Due to defined melting of the thermoplastic matrix component it is thus possible to generate a homogeneous connection between function module and composite structure within in the manufacturing process of thermoplastic composite structure, whereby the adhesive bonding assembly step is omitted.