Fully Integrated Dual-Polarized Antenna Array with Ultra-Wideband Single-Chip CMOS Receiver (DataRace)

在正在进行的第一个项目阶段的3D集成的小型发射机阵列和CMOS功率放大器在W波段使用低成本的立体光刻工艺进行了演示。35 GHz的可用带宽，双极化，并使用适度复杂的调制方案足以为数据速率高达100 Gbit/s。本提案的主要目标是将这一概念扩展到一个完整的接收器，具有独立的波束转向的两个极化，并演示在100 Gbit/s的数据传输。因此，由W波段宽带圆极化天线及其后续100 Gbit/s接收器芯片组成的先进前端应在系统级封装中实现，并应用作更大阵列的元件。芯片的功能应包括下变频和转换到数字域。与之前相同的低成本3D制造工艺将用于天线设计和接收器芯片的集成。芯片设计由柏林工业大学Böck教授（射频部分）和Gerfers教授（数字部分）的工作组（WG）负责，天线和封装问题由汉堡-哈堡工业大学Jacob教授（TUHH）的工作组负责。应与杜伊斯堡-埃森大学的SPP 1655项目Tera 50+合作，对系统性能进行实验验证。这样，将研究与较大阵列内的完整接收器单元相关联的接收器侧和较高集成密度。

In the ongoing first project phase the 3D-integration of a small transmitter array and a CMOS power amplifier at W-band using a low-cost stereolithographic process is demonstrated. The available bandwidth of 35 GHz, dual-polarization, and the use of moderately complex modulation schemes suffice for data rates up to 100 Gbit/s.The main goal of the present proposal is to extend this concept to a complete receiver with independent beam-steering for the two polarizations and to demonstrate data transmission at 100 Gbit/s. An advanced frontend consisting of a wideband, circularly polarized antenna at W-band and its subsequent receiver chip for 100 Gbit/s shall thus be implemented in a system-in-package and shall be used as an element of a larger array. The functionality of the chip shall include down-conversion and conversion to the digital domain. The same low-cost 3D-manufacturing process as previously shall be used for the antenna design and the integration of the receiver chip. The chip design shall be performed by the Working Groups (WG) of Prof. Böck (RF part) and Prof. Gerfers (digital part) from TU Berlin, while the antenna and packaging issues shall be addressed by the WG of Prof. Jacob from TU Hamburg-Harburg (TUHH). The system performance shall be experimentally verified in cooperation with the SPP1655 project Tera50+ from the University at Duisburg-Essen. This way the receiver side and the higher integration density associated with a complete receiver unit within a larger array will be investigated.