Preparation of Corrosion-Resistant Amorphous Surface Alloys

为了通过溅射在传统的晶体衬底上制备耐腐蚀的非晶态表面合金，开展了合作研究，以澄清溅射沉积缺陷的形成来源，通过这些缺陷腐蚀溶液渗漏到衬底金属，进而腐蚀衬底金属，并建立形成无缺陷溅射沉积的条件。(1)在洁净室中安装了直流磁控溅射机，以避免异物附着在衬底上和溅射真空室受到异物污染。靶材和衬底的表面抛光必须在洁净室内进行。(2)真空室预抽真空充分。99.999%的纯Ar气体通过过滤器去除粉尘、H_2O和O_2。将净化后的高纯度Ar气体用于溅射。(3)为了避免表面合金Du…中形成缺陷对于杂质含量较高的非均质靶材，由金属板嵌入或放置合金元素的异质靶材比烧结合金靶材要好得多。当使用异质靶时，溅射表面合金的区域成分异质性可以通过改变衬底相对于靶的位置来避免。(4)溅射气体的高压降低了表面合金与衬底金属之间的粘附性，同时表面合金也受到了Ar气体的污染，而溅射的低气压由于表面合金的压应力增加，导致表面合金从衬底金属上剥落的倾向增加。因此，溅射必须在适当的气压下进行，例如大约10℃~4℃。(5)衬底的微观不均匀会导致表面合金缺陷的形成，因此必须在微观上均匀地使用衬底。为此，通过抛光或电抛光对衬底表面进行镜面抛光是有用的。较少

In order to prepare corrosion-resistant amorphous surface alloys on conventional crystalline substrate metals by sputtering, collaborative studies were performed to clarify the origin of formation of defects of sputter-deposits through which corrosive solutions leak to the substrate metals with a consequent corrosive attack of the substrate metals, and to establish the conditions for the formation of defect-free sputter deposits.(1) A DC magnetron sputtering machine was installed in a clean room in order to avoid adherence of foreign substances to the substrate and contamination of the sputtering vacuum chamber with foreign substances. Surface finishing of the target and substrate must be done in the clean room.(2) The vacuum chamber was pre-evacuated sufficientyl. The 99.999% pure argon gas was passed through filters for removal of dust, H_2O and O_2. The high purity argon gas thus purified was used for sputtering.(3) In order to avoid the formation of defects in the surface alloys du … More e to impurities, the heterogeneous target consisting of a metel plate on which alloying elements were embedded or placed was rather better than the sintered alloy target. When the heterogeneous target was used, regional compositional hetero-geneity of the sputtered surface alloy was avoidable by continuous change in the position of the sub-strate relative to the target.(4) The high pressure of the sputtering argon gas decreases the adhesiveness between the surface alloy and the substrate metal in addition to contamination of the surface alloy with argon gas, while the low pressure of the sputtering argon gas results in increase in the tendency of exfoliation of the surface alloy from the substrate metal due to an increase in the compressive stress of the surface alloy. Therefore, sputtering must be done under adequate pressures of argon gas such as about 10^<-4> torr.(5) Microscopic unevenness of the substrate gives rise to the formation of defective surface alloys, and hence microscopically even substrate must be used. For the purpose mirror-like finishing of the sub-strate surface by buffing or electrtopolishing was useful. Less