PVD cluster tool

微纳米系统的研究需要一个三腔组工具，用于沉积共溅射金属、反应溅射层，如氮化铝和金属氧化物，以及蒸发。通过将这些工艺组合成一个集群，不同的工艺可以在不损失真空度的情况下应用于晶片。目前还没有类似的系统，但对未来的研究来说是必要的。波鸿鲁尔大学微系统技术教席成立于2017年。这位前材料和纳米电子学主席曾在1平方厘米大小的衬底上工作，唯一可用的PVD工艺是蒸发。一个合适的洁净室是可用的，目前已扩展到200 mm晶片处理。金属在MEMS中起着布线、加热元件和温度传感器的关键作用，并且几乎所有微系统工艺都需要具有可重复使用的参数。由纳米厚度的镍和铝等金属制成的多层膜系统也是MEMS组装中反应焊接的一种有趣的新选择。反应溅射层，特别是氮化铝(AlN)是功能薄膜的重要修饰。AlN具有化学和机械稳定性，并具有压电性能，它是以c轴取向沉积的。它可应用于执行器和能量收集器，还可在硅上实现高度稳定的膜系统。蒸发和预构模板的结合导致了一种自组织纳米结构的掠角沉积。当它们应用于微系统时，它们显示出独特的性质。这些特性不是通过溅射就能达到的。所请求的簇涵盖了MEMS的所有三种基本物理沉积过程，并允许在不离开真空的情况下沉积任意组合的层。安全地防止了源和衬底的表面氧化。其中一个腔室将携带反向溅射蚀刻工具，用于在第一次沉积发生之前清洗衬底。该系统专为直径100-200 mm的晶片设计，因为它必须与结合原子层沉积、原子层刻蚀、反应离子刻蚀和等离子体增强化学气相沉积的2D材料的集群工具兼容。该集群目前是在BMBF ForLab计划(ForLab-项目PICT2DES)内建立的，旨在用于200 mm晶圆。它有一个与德国密克罗埃勒克特罗尼克空军基地的接口。

Micro- and nanosystems research requires a three-chamber cluster tool for the deposition of co-sputtered metals, reactive sputter layers such as AlN and metal oxides and evaporation. By combining those processes into a cluster, the different processes can be applied to a wafer without loss of vacuum. A comparable system is not yet available, but necessary for future research. The Chair for microsystems technology at Ruhr-Universität Bochum was established in 2017. The former Chair for materials and nanoelectronics has worked on substrates of 1 cm2 size, and the only available PVD process was evaporation. A suitable clean room is available and is currently extended for 200 mm wafer handling.Metals play a key role as wiring, heating elements and temperature sensors for MEMS and are required with reproducible parameters for almost all microsystems processes. Multi-layer systems from metals such as nickel and aluminium at nanometer thickness are also an interesting new alternative for a reactive soldering in the assembly of MEMS.Reactively sputtered layers, especially aluminium nitride (AlN), are an important amendment of functional thin films. AlN is chemically and mechanically stable and exhibits piezoelectric properties, it is deposited with c-axis orientation. It is applied in actuators as well as energy harvesters and allows also highly stable membrane systems on silicon. Evaporation in combination with pre-structured templates causes a kind of glancing angle deposition of self-organizing nanostructures. They show unique properties when applied to microsystems. These properties cannot be reached by sputtering. The requested cluster covers all three basic physical deposition processes for MEMS and allows to deposit arbitrary combinations of layers without leaving the vacuum. The surface oxidation of the sources as well as of the substrates is prevented safely. One of the chambers will carry an inverse sputter etching tool for substrate cleaning before the first deposition takes place. The system is designed for 100 – 200 mm wafer diameter as it has to be compatible to a cluster tool for 2D materials combining atomic layer deposition, atomic layer etching, reactive ion etching and plasma-enhanced chemical vapour deposition. This cluster is currently established within the BMBF ForLab initiative (ForLab-project PICT2DES) and intended for use with 200 mm wafers. It has an interface to the Forschungsfabrik Mikroelektronik Deutschland.