Efficient coolant lubricant application in narrow kerfs when sawing titanium alloys by simulation of thermal and mechanical fluid-solid interactions (Effi-Ti-Sim)

本项目的目的是开发一个仿真模型来计算钛合金圆锯机的效率优化设计。该模型必须提供尽可能低的KSS压力和体积流量，从而在不同的加工条件下实现最佳的冷却效果、摩擦学和切屑在刀具间隙中的传输。在该项目的第一阶段，对锯切过程中的机理进行了基本的实验和模拟研究。模型方法是所需模拟模型的基础，必须基于对高动态切屑形成、热传输机制和流体力学(包括流固耦合相互作用)的全面了解。在项目的第二阶段，在部分理想化条件下开发的切屑形成、多相流和芯片空间内的换热的独立模型将被合并、参数化和合并。通过利用已实现和验证的测试设置进行进一步的实验，进行了加固和参数化。子模型一方面使用ABAQUS中的CEL方法进行组合，另一方面通过耦合ABAQUS和CFD软件OpenFOAM或FLUENT进行组合。两个责任区都计划与SPP内的其他子项目进行密集交流。为了扩大参数领域，试验台在提高表面温度的情况下运行，因此，除了对流汽液相互作用外，还可以考虑辐射影响。两个换热试验台已经在中等温度下提供了初步结果，也用于进一步表征芯片空间中同时蒸发KSS的颗粒流动。

The aim of this project is to develop a simulation model to calculate an efficiency-optimized design of the circular sawing of titanium alloys in advance. This model has to provide the lowest possible KSS pressure and volume flow for which an optimal cooling effect, tribology and chip transport in the cutting gap for different machining conditions is achieved. In the first phase of the project, fundamental experimental and simulative investigations of mechanisms in the sawing process were carried out. The model approaches, on which the desired simulation model is based, must be rooted on a comprehensive understanding of highly dynamic chip formation, heat transport mechanisms and fluid mechanics including the coupled fluid-solid interactionsIn the second phase of the project, the separate models for chip formation, the multi-phase flow and the heat transfer in the chip space, which were developed under partially idealized conditions, are to be consolidated, parameterized and merged. The consolidation and parameterization take place via further experiments with the realized and validated test setups. The sub-models are combined using the CEL approach in ABAQUS on the one hand and by coupling ABAQUS and the CFD software OpenFOAM or FLUENT on the other. An intensive exchange with other sub-projects within the SPP is planned for both areas of responsibility.To expand the parameter field, the test rigs are operated at increased surface temperatures, so that in addition to convective vapour-liquid interactions, radiation influences can also be taken into account. The two test rigs for heat transfer, which have already provided initial results at moderate temperatures, are also intended for the further characterization of particle-laden flows in the chip space with simultaneous evaporation of the KSS.