Fun2D+ | 3D functional mesoscopic system based on 2D materials

功能系统的小型化继续通过增加单个系统组件的集成密度来实现。然而，到目前为止，在单片集成领域很少开发的是第三几何维度。长期以来，人们一直希望通过系统级封装、系统级芯片和其他3D封装概念实现更高的封装密度，但封装和基板材料主导了当前的系统设计。本方案的目标是构建一个由电源、数据处理、传感器系统和数据传输组成的高集成度系统。为此，将使用非常规的MEMS折纸方法。这种方法允许在二维状态中集成所有必要的组件，并随后将其转换为更紧凑的三维状态。最终三维结构的内部体积将用于通常难以小型化的元件，例如能量供应（例如三维线圈）和能量存储（电容器）。为了使高度小型化的系统具有低能耗和高功能，二维材料一直被用作面向未来的电子技术平台。

The miniaturization of functional systems continues to be achieved by increasing the integration density of the individual system components. However, little exploited so far in the field of monolithic integration is the third geometric dimension. For a long time, there has been a desire to achieve higher packing density with system-in-package, system-on-chip, and other 3D packaging concepts, but packaging and substrate materials dominate current system designs. The aim of this proposal is to build a significantly higher integrated system consisting of power supply, data processing, sensor system and data transmission. For this purpose, the non-conventional method of MEMS origami will be used. This method allows integration of all necessary components in the 2-dimensional state and subsequent transformation of it into the much more compact 3-dimensional state. The internal volume of the final 3-dimensional structure will be used for elements that are usually difficult to miniaturize, such as energy supply (e.g., 3-dimensional coils) and energy storage (capacitors). In order to enable highly miniaturized systems with low energy consumption and highly functional 2-dimensional materials are consistently used as a future-oriented technology platform for electronics.