Fast dipole approximation to analyze the scattering and radiation of arbitrary wire and slot configurations in cavities and free space

电子设备有金属外壳，以保护敏感元件免受外部影响，并确保机械稳定性。同时，由于相应的波在导电表面上反射或在屏蔽材料内部阻尼，这种外壳屏蔽了内部和外部区域免受电磁相互作用的影响。然而，由于技术原因，大多数外壳都有开口，例如通风槽，通过它两个区域是电磁耦合的。这些耦合特性的研究对于评估设备的抗干扰性和发射性越来越重要，因为由于现代电子设备中时钟频率的上升，耦合的强度将在未来继续增加。这就产生了频率越来越高的电磁场，与孔洞的相互作用越来越大，因此必须认为孔洞的电容量很大。目前用数值方法来描述这种相互作用。在那里，问题被转换成数学模型，其中对相互作用过程的物理分析是不可能的，并且只能在非常有限的程度上有助于一般的理解。此外，金属腔是高共振系统，这导致在求解数学模型时存在收敛性和大量未知量的问题。因此，对电磁波在电大孔径处的散射进行大量的分析性描述是本项目的主题。这种方法允许。所涉及的相互作用过程的物理解释；与以往的方法相比，散射场的计算速度非常快；并对散射过程有一个大致的了解。推广了一种描述电磁波在直、薄导体和槽形孔上散射的新方法，以便解析地描述任意形状的一维结构上的散射过程。为此，利用解析正则化方法将整个问题分解为源场的近、远相互作用，利用各部分的特征性质寻找解析解。预计解决方案的不同部分对应于不同的散射过程，从而有助于更深入地理解整体问题，正如申请人已经证明的那样，直结构并发表在知名期刊上。结果应该是一种描述任意形状的一维结构上散射的新方法，其中相互作用是解析计算的，因此非常快速，同时使用已建立的数值方法和测量进行验证。

Electronic devices have metallic housings to protect the sensitive components from external influences and to ensure mechanical stability. At the same time, such housings shield the inner and outer area from electromagnetic interactions, since the corresponding waves are reflected on the conductive surface or are damped inside the shield material. However, for technical reasons, most housings have openings, e. g. ventilation slots, through which the two regions are electromagnetically coupled. The investigation of these coupling properties is of increasing importance for the assessment of the immunity to interference and the emission of a device, since the intensity of the coupling will continue to increase in the future due to rising clock frequencies in modern electronic devices. This leads to electromagnetic fields at ever higher frequencies, which interact more and more with the apertures, which must then be considered to be electrically large.Currently numerical methods are used to describe this interaction. There the problem is converted into mathematical models, where a physical analysis of the interaction processes is not possible and which can only contribute to a general understanding to a very limited extent. In addition, metallic cavities are highly resonant systems, which leads to problems in solving the mathematical models with regard to convergence and a very large number of unknowns.A largely analytical description of the scattering of electromagnetic waves at electrically large apertures is therefore the subject of this project. This approach allows1. a physical interpretation of the interaction processes involved,2. a very fast calculation of the scattered fields compared to previous methods,3. and gaining a general understanding of the scattering process.A new method for describing the scattering of electromagnetic waves on straight, thin conductors and slot-shaped apertures is to be generalized in order to analytically describe the scattering processes on arbitrarily shaped one-dimensional structures. For this purpose, the overall problem is separated into the near and far interaction of the sources and fields using the analytical regularization method, in order to find analytical solutions using the characteristic properties of the parts. It is expected that the different parts of the solution correspond to different scattering processes and thus contribute to a deeper understanding of the overall problem, as has already been demonstrated by the applicant for straight structures and published in renowned journals. The result should be a new method for describing the scattering on arbitrarily shaped one-dimensional structures, in which the interaction is calculated analytically and therefore very fast, while being validated using established numerical methods and measurements.