Development of ESPI camera for diagnosis of material degradation

电子散斑干涉术（ESPI）是一种很有前途的全场变形分析实验技术。该技术的发展使我们能够观察变形的动态特征，我们称之为动态电子散斑干涉（DESPI）。本文首先介绍了用于材料退化诊断的动态电子散斑干涉技术（DESPI）的发展。(2)To评价退化，介绍了基于物理细观力学的场理论解释。研究塑性变形过程的动力学行为具有重要意义。（3）新提出的DESPI方法，使研究整个场地变形的全过程成为可能。(4)In通过对铝合金和不锈钢试样的拉伸实验，发现了在试样上扩展的特征应变局部化现象。（5）对散斑条纹进行了定量分析。(6)A设计并制作了小型DESPI相机，研究了相机的疲劳过程。（7）将该方法应用于植物生长状态等生物目标运动特征的非接触测量。（8）进一步将该方法用于研究微观物体的变形。将Micro-DESPI应用于MEMS运动特性诊断。（9）最后提出了对未来的展望。

Electronic Speckle Pattern Interferometry (ESPI) is a promising experimental technique whole-field deformation analysis. The technique has been developed to make possible to observe dynamic feature of deformation which we call dynamic ESPI (DESPI). In this report, at first, (1)development of dynamic ESPI (DESPI) for diagnosis of material degradation is present. (2)To evaluate degradation, field theoretical interpretation based on physical meso-mechanics is introduced. It is important to investigate dynamic behavior of plastic deformation process. (3)Newly proposed DESPI makes possible to investigate entire process of whole field deformation. (4)In tensile experiments of aluminum alloy samples and stainless steal samples, we found characteristics strain localization which propagate on the samples. (5)Quantitative analysis of speckle fringes are also presented. (6)A compact DESPI camera was designed and produced and fatigue process were investigated. (7)The proposed method, which is non-contact method, was applied to investigate moving feature of bio-objects such like growing state of a plant. (8)Further more the proposed method was progressed to investigate deformation of microscopic object. Micro-DESPI was applied to diagnose moving feature of MEMS. (9)Finally future expectation will be presented.