Automated 300mm Wafer Test System

慕尼黑工业大学电路设计主席的科学工作重点是传感器与读出电路的集成以及由此带来的传感器性能的改进。集成在硅晶片或晶片片上的更大数量的传感器和相关联的读出电路可以提供比经由单个传感器可能的更全面的传感器和/或待测量的环境参数的图像。为了展示这种多传感器系统的优点，有必要将传感器技术与集成电路集成在一起，如果可能的话，集成在一块硅上，作为片上系统或芯片级倒装芯片封装中的系统。在电路设计主席处，电路和传感器系统概念通过合作伙伴（例如，TUM的ZEITlab -参见第3.2节）和半导体代工厂（合同制造商，如Global Foundries和XFAB）。然后，这些电路必须在尽可能接近应用的边界条件下进行测试-也是由于制造波动的统计原因-关于其电气特性。在某些情况下，这还需要对电路进行微调。对于这些表征和调整，需要测量设备，其允许测量电路的一定吞吐量和环境条件的最灵活的可能修改（如温度或机械应力）和电边界条件（如电源电压）。该应用的核心是一台300 mm晶圆探测器，其为了传感器技术的目的而配备有特殊的可调节能力，例如外部供应的调温空气、用液体润湿以及在待测量的晶片上施加限定的偏压。此外，该晶圆探测器将配备用于电气测量的机械手和专门适用的测量设备，用于精确采集所研究电路的数据（感应电流，电压及其时间特性，由于传感器的属性）。由于集成在晶圆上的电路通常只能以不够精确的精度制造，因此需要半自动机器来提高测量吞吐量，以及额外的激光器来微调某些电路参数。此外，测量站将配备传感器应用所需的测量设备，因为它们是当前正在进行的、应用的和可预见的未来传感器项目所需要的。由于纳米传感器的一个新的重点领域目前正在TUM建立（也有新的教授职位），测量设置也配备齐全，以支持其他研究小组在这个重点领域内跨椅子和教师自己的ZEITlab框架内的工作。

The focus of the scientific work of the Chair of Circuit Design at the TU Munich is the integration of sensors with readout circuits and the resulting improvements in sensor properties. A larger number of sensors integrated on a silicon wafer or wafer piece and the associated readout circuits can provide a much more comprehensive picture of the sensor and/or environmental parameters to be measured than is possible via single sensors. In order to demonstrate the advantages of such multi-sensor systems, it is necessary to integrate the sensor technology with integrated circuits, if possible on one piece of silicon, together as a system on chip or system in chip-scale flip-chip package.At the Chair of Circuit Design, circuit and sensor system concepts are designed, verified, and fabricated via partners (e.g., TUM's ZEITlab - see Section 3.2) and semiconductor foundries (contract manufacturers such as Global Foundries and XFAB). These circuits must then be tested under boundary conditions that are as close to the application as possible - also statistically due to manufacturing fluctuations - with regard to their electrical properties. In some cases, this also requires trimming of the circuits. For these characterizations and adjustments, measurement equipment is needed that allows both a certain throughput of circuits to be measured and the most flexible possible modification of the environmental conditions (such as temperature or mechanical stress) and the electrical boundary conditions (such as the supply voltage).The core of the application is a 300 mm wafer prober, which is to be equipped for the purposes of sensor technology with special metrological capabilities such as externally supplied tempered air, wetting with liquids and the application of a defined bias on the wafers to be measured. In addition, this wafer prober is to be equipped with manipulators for electrical measurements and specially adapted measuring devices for accurate data acquisition (induced currents, voltages and their time characteristics due to the sensor properties) of the circuits under investigation. Since the circuits integrated on the wafer can often only be manufactured with insufficient accuracy, a semi-automatic machine is requested here for higher measurement throughput, as well as an additional laser for trimming certain circuit parameters. Furthermore, the measuring station is to be equipped with the measuring devices necessary for sensor applications, as they are required in currently active, applied for and foreseeable future sensor projects. Since a new focus area of nanosensors is currently being established at TUM (also with new professorships), the measurement setup is also well equipped to support other research groups in their metrological work here within this focus area across chairs and within the framework of the faculty's own ZEITlab.