Nanostructured Thin Film Metallic GLASSes with superior mechanical/Electrical properties

金属薄膜玻璃(TFMG)是一种新兴的材料，具有传统晶体合金无法实现的优异的机械和电学性能组合。具体地说，TFMG的特点是缺乏长程原子周期性，并且没有晶体材料常见的缺陷，因此具有优异的机械性能和金属导电性，使它们成为日益增长的可拉伸电子学领域的候选材料。尽管有这些潜在的应用，但先进的TFMG的工程微结构的合成和对其机械/电学性能的理解还很难解决，需要开发新的合成策略和亚微米尺度的尖端表征技术。在这种背景下，EGLASS项目旨在开发具有量身定制的纳米级设计的先进TFMGs，例如具有大自由体积的界面、团簇组装结构、多层和嵌入纳米晶体的非晶膜，从而实现优异的机械/电学性能的结合。将采用尖端的现场表征技术，包括压缩微柱和结合高级结构表征(HRTEM/APT)测量局部电性能，以掌握基本物理行为并了解结构与机械/电性能之间的联系。该项目将融合LSPM(溅射、脉冲激光沉积和原位机械表征、从头计算分子动力学模拟)和KIT(先进的合成路线、结构/电学表征)的独特专业知识，促进TFMG作为未来可拉伸电子材料的应用。法德联合团队融合了不同材料科学领域公认的专业知识和他们对金属玻璃和薄膜的深厚知识。在密切的合作下，两个团队将研究TFMG的以下基本问题：(I)新型TFMG结构的合成，(Ii)微尺度的机械/电学性能，(Iii)composition-microstructure-mechanical/electrical性能的关系，重点是提高机械性能和导电性的关键参数，(Iv)将TFMG用于结合附着力、可延展性和导电性的可拉伸电子产品。

Thin Film Metallic Glasses (TFMGs) are an emerging class of materials, with the potential to realize exceptional combinations of mechanical and electrical properties so far unachievable by conventional crystalline alloys. Specifically, TFMGs are characterized by the lack of long-range atomic periodicity together with the absence of defects common to crystalline materials, resulting in outstanding mechanical properties and metallic electrical conductivity and making them interesting candidates within the growing domain of stretchable electronics. Despite these potential applications, the synthesis of advanced TFMGs with engineered microstructure and the understanding of their mechanical/electrical properties is barely tackled, requiring the development of novel strategies for their synthesis and cutting-edge techniques for sub-micrometer scale characterization.In this context, the EGLASS project aims to develop advanced TFMGs with tailored nanoscale design such as interfaces with large free-volume, cluster-assembled structures, multilayers and amorphous films with embedded nanocrystals resulting in outstanding combination of mechanical/electrical properties. Cutting-edge in situ characterization techniques including compression of micropillars and measurement of local electrical properties combined with advanced structural characterization (HRTEM/APT) will be employed to grasp the fundamental physical behaviour and understand the connection between the structure and mechanical/electrical properties. The project will merge the unique expertise of LSPM (sputtering, pulsed laser deposition and in situ mechanical characterization, Ab initio molecular dynamics simulations) and KIT (advanced synthesis routes, structural/electrical characterization) fostering the application of TFMGs as future materials for stretchable electronics.The joint French-German team merges the recognized expertise in different fields of materials science and their deep knowledge of metallic glasses and thin films. In a close cooperation, the teams will investigate the following fundamental issues of TFMGs: (i) synthesis of novel TFMGs architectures, (ii) microscale mechanical/electrical properties, (iii) relation composition-microstructure-mechanical/electrical properties focusing on key parameters to increase mechanical properties and electrical conductivity, (iv) use of TFMGs for stretchable electronics combining together adhesion, stretchability, conductivity.