Nanostructured Thin Film Metallic GLASSes with superior mechanical/Electrical properties

薄膜金属玻璃（tfmg）是一种新兴的材料，具有实现传统晶体合金迄今无法实现的机械和电气性能的特殊组合的潜力。具体来说，tfmg的特点是缺乏长程原子周期性，并且没有晶体材料常见的缺陷，从而具有出色的机械性能和金属导电性，并使其成为可拉伸电子学领域中有趣的候选者。尽管有这些潜在的应用，但具有工程微观结构和对其机械/电气性能的理解的先进tfmg的合成几乎没有得到解决，需要开发新的合成策略和亚微米尺度表征的尖端技术。在此背景下，EGLASS项目旨在开发具有定制纳米级设计的先进tfmg，例如具有大自由体积的界面，簇组装结构，多层和嵌入纳米晶体的非晶态薄膜，从而实现机械/电气性能的出色组合。尖端的原位表征技术，包括微柱压缩和局部电性能测量，结合先进的结构表征（HRTEM/APT），将被用来掌握基本的物理行为，并了解结构和机械/电性能之间的联系。该项目将融合LSPM（溅射，脉冲激光沉积和原位机械表征，从头算分子动力学模拟）和KIT（先进合成路线，结构/电气表征）的独特专业知识，促进tfmg作为可拉伸电子产品的未来材料的应用。法德联合团队融合了材料科学不同领域的公认专业知识以及他们在金属玻璃和薄膜方面的深厚知识。在密切的合作中，团队将研究tfmg的以下基本问题：(i)新型tfmg结构的合成，（ii）微观机械/电性能，（iii）关系组成-微观结构-机械/电性能，重点关注提高机械性能和电导率的关键参数，（iv）将tfmg用于结合粘附性，可拉伸性和导电性的可拉伸电子器件。

Thin Film Metallic Glasses (TFMGs) are an emerging class of materials, with the potential to realize exceptional combinations of mechanical and electrical properties so far unachievable by conventional crystalline alloys. Specifically, TFMGs are characterized by the lack of long-range atomic periodicity together with the absence of defects common to crystalline materials, resulting in outstanding mechanical properties and metallic electrical conductivity and making them interesting candidates within the growing domain of stretchable electronics. Despite these potential applications, the synthesis of advanced TFMGs with engineered microstructure and the understanding of their mechanical/electrical properties is barely tackled, requiring the development of novel strategies for their synthesis and cutting-edge techniques for sub-micrometer scale characterization.In this context, the EGLASS project aims to develop advanced TFMGs with tailored nanoscale design such as interfaces with large free-volume, cluster-assembled structures, multilayers and amorphous films with embedded nanocrystals resulting in outstanding combination of mechanical/electrical properties. Cutting-edge in situ characterization techniques including compression of micropillars and measurement of local electrical properties combined with advanced structural characterization (HRTEM/APT) will be employed to grasp the fundamental physical behaviour and understand the connection between the structure and mechanical/electrical properties. The project will merge the unique expertise of LSPM (sputtering, pulsed laser deposition and in situ mechanical characterization, Ab initio molecular dynamics simulations) and KIT (advanced synthesis routes, structural/electrical characterization) fostering the application of TFMGs as future materials for stretchable electronics.The joint French-German team merges the recognized expertise in different fields of materials science and their deep knowledge of metallic glasses and thin films. In a close cooperation, the teams will investigate the following fundamental issues of TFMGs: (i) synthesis of novel TFMGs architectures, (ii) microscale mechanical/electrical properties, (iii) relation composition-microstructure-mechanical/electrical properties focusing on key parameters to increase mechanical properties and electrical conductivity, (iv) use of TFMGs for stretchable electronics combining together adhesion, stretchability, conductivity.