Precision picosecond laser for the microstructuring of materials

本提案的主题是采购一个系统（“精密皮秒激光器”），用于研究新的传感器和传感器集成概念的各种材料的高分辨率和材料节约结构和表面处理。主要焦点是第一代和第二代基于自旋的量子传感器及其集成。更具体地说，该系统最初将主要用于研究和设计小型化和可扩展的核磁共振（NMR）和电子自旋共振（EPR）传感器，以及基于半导体材料（如金刚石和碳化硅（SiC））缺陷的量子传感器。这种传感器通常需要高空间均匀性的共振射频（RF）磁场（B1场）来控制自旋量子位。此外，为了获得最佳性能，该B1场必须具有高时间分辨率的振幅和相位可调。以一种可扩展的方式设计这种传感器并具有优异性能的一种可能性是使用芯片集成电子设备-所谓的核磁共振或epr芯片收发器-用于所需的激励和读出电子设备。所需的场产生结构（线圈或谐振器）既可以在芯片上协集成，也可以在芯片外实现。平面片上线圈提供最小的寄生电容和引线电阻，但由于其有限的（平面）几何形状，在B1场的可实现均匀性方面受到限制。在这里，所要求的器件提供了在片上线圈中心创建孔的可能性，这使得可以显着增加片上线圈的可用敏感区域，同时显着提高可实现的均匀性。在目前的先进技术中，在特殊衬底上的高频印刷电路板（pcb）通常用于实现片外线圈和谐振器。在这里，由于其高空间分辨率，所要求的设备能够设计小型化和高效的射频和微波结构。在这里，类似于片上线圈，激光可用于在结构中创建孔，以增加可用的敏感体积和可实现的均匀性。在较低的频率下，也可以使用柔性衬底，通过滚动或折叠衬底，使3D线圈具有高B1场的均匀性。在这里，所要求的系统非常适合于构建这种柔性基板的金属化，也适合于构建基板本身。除了上述应用之外，所要求的激光系统还将用于非导电基板（如聚合物）的空间选择性激活，以使其空间选择性金属化。

The subject of this proposal is the procurement of a system ("precision picosecond laser") for high-resolution and material-conserving structuring and surface treatment of a wide variety of materials for research into new sensor and sensor integration concepts. The main focus is on 1st and 2nd-generation spin-based quantum sensors and their integration. More specifically, the system will initially primarily be used for the research and design of miniaturized and scalable nuclear magnetic resonance (NMR) and electron spin resonance (EPR) sensors, as well as quantum sensors based on defects in semiconductor materials such as diamond and silicon carbide (SiC). Such sensors usually require a resonant radio frequency (RF) magnetic field (B1 field) of high spatial homogeneity to control the spin qubits. In addition, for optimum performance, this B1 field must be adjustable in its amplitude and phase with high temporal resolution. One possibility to design such sensors in a scalable way and with excellent performance is to use chip-integrated electronics – so-called NMR- or EPR-on-a-chip transceivers – for the required excitation and readout electronics. The required field generating structures (coils or resonators) can either be co-integrated on the chips or realized off-chip. Planar on-chip coils offer minimal parasitic capacitances and lead resistances but are limited in the achievable homogeneity of the B1 field due to their restricted (planar) geometry. Here, the requested device offers the possibility to create holes in the center of the on-chip coils, which makes it possible to significantly increase the usable sensitive area of the on-chip coil and, at the same time, to improve the achievable homogeneity significantly. In the current state-of-the-art, high-frequency printed circuit boards (PCBs) on special substrates are often used to realize off-chip coils and resonators. Here, thanks to its high spatial resolution, the requested device enables the design of miniaturized and highly efficient RF and microwave structures. Here, similar to on-chip coils, the laser can be used to create holes in the structures to increase the usable sensitive volume and the achievable homogeneity. At lower frequencies, it is also possible to use flexible substrates, which enable 3D coils with high homogeneity of the B1 field by rolling or folding the substrate. Here, the requested system is ideally suited both for structuring the metallization of such flex substrates and for structuring the substrates themselves. In addition to the aforementioned applications, the requested laser system will also be used for the spatially selective activation of non-conductive substrates such as polymers to enable their spatially selective metalization.