UV-Mask- and Bond-Aligner

紫外光掩模对准器是微系统技术研究的基本工具。目前，微系统技术主席拥有一个30岁的3”掩模对准器，只有。界面主导型高性能材料中心（ZGH，RUB核心设施）提供了用于150 mm晶圆的掩模对准器。MEMS和2D电子研究领域的研究项目，特别是与科学和工业合作伙伴的合作，需要一个升级到200 mm的衬底，例如与FhG IMS杜伊斯堡（Forschungsfabrik Mikroelektronik Deutschland，FMD）合作用于2D电子。关于这一点，洁净室升级为200 mm，掩模对准器是连续100 mm和200 mm MEMS生产线唯一缺少的环节。2021年，安装了三腔室PVD集群工具（DFG）和五腔室ALD/RIE集群，两者均适用于高达200 mm。ISO 6光刻洁净室配备了工作台，并包括用于抗蚀剂的200 mm旋涂集群。此外，微纳集成需要使用用于光学、电子和传感应用的软柔性模板的纳米压印光刻，也用于柔性和薄玻璃基板。对于MEMS以及对于柔性衬底的时间稳定性，两个晶片或衬底的接合是重要的，这可以利用掩模对准器的对准系统来执行。对掩模和键合对准器的要求包括背面对准，正面优于1微米，背面优于2微米，以及基于LED的UV源，其导致对于具有硬接触或真空接触的线和空间的光学分辨率优于1微米。它允许无汞使用，无需预热时间和氮气吹扫源，但商业抗蚀剂（包括干抗蚀剂和高分辨率薄膜抗蚀剂）的发射光谱相似。必须使用厚度从30 μm到5 mm的晶圆和接近功能。手动装载掩模和晶圆，视觉控制应支持对准。100 mm和200 mm基板需要掩模和晶圆卡盘，因为这两种尺寸的使用取决于研究项目。精确对准功能用于掩模和焊接对准。粘合将由聚合物支撑，用于暂时稳定基材或用于永久层压。它不仅用于薄玻璃基板的稳定处理，还用于晶圆级MEMS封装。

An UV mask aligners is a basic tool for microsystems technology research. Currently, the Chair for Microsystems Technology owns a 30-year-old 3" mask aligner, only. A mask aligner for up to 150 mm wafers is available at the Center for Interface-Dominated High Performance Materials (ZGH, RUB core facility). Research projects in the fields of MEMS and 2D electronics research, especially in cooperation with scientific and industrial partners require a step-up to 200 mm substrates, e.g. in cooperation with FhG IMS Duisburg (Forschungsfabrik Mikroelektronik Deutschland, FMD) for 2D electronics. With respect to this, the cleanroom was upgraded for 200 mm, the mask aligner is the only missing link for a continuous 100 mm and 200 mm MEMS line. In 2021, a three-chamber PVD cluster tool (DFG) and a five-chamber ALD/RIE cluster were installed, both suitable for up to 200 mm. The ISO 6 lithography cleanroom is equipped with work benches and includes a 200 mm spincoating cluster for resists. Micro-nano-integration requires moreover nanoimprint-lithography using soft flexible templates for optical, electronic and sensing applications, also for flexible and thin glass substrates. For MEMS as well as for the temporal stabilization of flexible substrates, bonding of two wafers or substrates is important, that can be performed with the alignment system of the mask aligner. The requirements for the mask and bond aligner include backside alignment with better than 1 micrometer on front and 2 micrometers on backside and an LED-based UV source resulting in an optical resolution better than 1 micrometer for lines and spaces with hard- or vacuum contact. It allows a Hg-free use without preheating time and nitrogen purge for the source but a similar emission spectrum for commercial resists including dry resists and high-resolution thin film resists. The use of wafers from 30 μm up to 5 mm thickness and a proximity function are mandatory. Masks and wafers are loaded manually, the alignment should be support by vision control. Mask and wafer chucks are required for 100 mm and 200 mm substrates, as both sizes are used depending on the research project. The precise alignment function is used for both mask and bond alignment. Bonding will be supported by polymers for a temporal stabilization of substrates or for a permanent lamination. It is used for a stabilized handling of thin glass substrates but also for MEMS packaging on waferlevel.