Silicon Imaging Device Construction Facility - Wirebonder

最先进的高精度半导体成像设备（用于高能粒子物理、同步加速器科学和医学成像）的开发需要现代装配设施的显著能力。在构建由细晶粒、多通道裸硅或其他半导体成像器件和定制电子芯片组成的测试和“生产”模块时，高可靠性、高灵活性的引线键合机是必不可少的工具。首席研究员在困难条件下成功完成了几个具有挑战性的项目，从而获得了国际声誉，这使得除了预期的器械开发计划外，还计划了几个项目。一台现代化的焊线机，以取代现有的30岁的机器，已成为关键，以保持我们在这一领域的领先地位。

The development of state-of-the-art, high precision semiconductor imaging devices (for high energy particle physics, synchrotron science and medical imaging ) requires a significant capability in modern assembly facilities. In constructing test and 'production' modules consisting of fine-grained, multi-channel bare silicon or other semiconductor imaging devices and custom electronic chips, a high-reliability, highly flexible wire-bonding machine is an essential tool. The international reputation from success in several challenging projects under difficult conditions, gained by the Chief Investigators has resulted in several more projects being planned in addition to a foreseen program of device development. A modern wirebonder, to replace the existing 30 year-old machine, has become critical to maintain our leading position in this area.