Research on High Speed Microcutting of Engineering Ceramics
Research on High Speed Microcutting of Engineering Ceramics
批准号:
60550085
负责人:
SUGITA Tadaaki
金额:
$1.02万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for General Scientific Research (C)
财政年份:
1985
资助国家:
日本
项目状态:
已结题
起止时间:
1985 至 1986
中文摘要
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英文摘要
As engineering ceramics has been recently utilized for mechanical components, improvement of machining performance is increasingly required. This study proposes high speed microcutting by daiamond tool as an new machining technique which performs crack-free surface finishing, in order to prevent the deterioration of the machined component due to machining processes, and elucidates the fundamental mechanism of microcutting of engineering ceramics.An argorithm for the analysis of the microcutting mechanism is proposed by application of fracture mechanics. According to the argorithm, the mechanism of plastic flow type material removal which enables crack-free machining is theoretically investigated by analyses of nonlenear fracture mechanics parameter J-integral and the distribution of cutting temperature at high cutting speed. By using a developed high speed micromachining device, the microcutting tests are carried out for selected engineering ceramics. The behaviour of formation and propagation of crack in associtation with the material removal process is also elucidated by means of in-situ scanning electron microscope observation.Analytical results suggest that the plastic flow type removal takes place in case of micromachining of partiaaly stabilized <ZrO_2> and WC-Co, while brittle fracture type removal occurrs for SiC and <Al_2O_3> . Also it is sugggested that as the depth of cut decreases and the cutting speed increeases, the type of material removal tends to change from brittle fracture type to plastic flow type. From the experimental spect, these findings are sustained, so that high fracture toughness ceramics such as <ZrO_2> and WC-Co produces plastic folw type chip which is similar to metal cutting, and even low fracture toughness materials such as Si-crystal, glass and <Si_3N_4> at high cutting speeds.
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杉田忠彰: 精密工学会誌. 52. 144-147 (1985)
杉田忠明:日本精密工程学会杂志 52. 144-147 (1985)。
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通讯作者:
Hitoshi Hiraga: "Study of Microcutting of Ceramics (4th Report) Analysis of Mechanism of Plastic Flow Type Material Removal by J-Integral" Preprint of Annual Meeting of Japan Soceity of Precision Engineering. 2. 591-592 (1986)
平贺仁:《陶瓷微切削研究(第4次报告)J-Integral塑性流动型材料去除机理分析》日本精密工程学会年会预印本。
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Tadaaki Sugita: "Possibility of Plastic Deformation Type Removal in Microcutting of Brittle Materials" Jounal of Japan Society of Precision Engineering. 52. 144-147 (1985)
杉田忠明:《脆性材料微切削中塑性变形型去除的可能性》日本精密工程学会会刊。
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Osamu Imanaka: Kensetsu Sangyou Tyousakai. Handbook of Machining of Ceramics, 15 (1987)
今中修:剑瑟相佑泰坂会。
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平賀仁: 精密工学会学術講演会論文集. 2. 591-592 (1986)
Hiraga, Hitoshi:日本精密工程学会学术会议记录 2. 591-592 (1986)。
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共 6 条
Evaluation of Lapping Mechanism by Visualization of Abrasive Grain
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批准号:06650135
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项目类别:Grant-in-Aid for General Scientific Research (C)
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资助金额:$1.02万
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财政年份:1994
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负责人:SUGITA Tadaaki
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依托单位:
海外基金