Studies on Micro Plastic Working

电子工业的最新发展需要一种高生产率的细孔穿孔技术。在本项目中，它试图适用于这种穿孔的一种新的制造工艺，使用粘塑性压力介质（VM过程），最近提出的首席研究员。主要研究结果如下：1.对单个细孔穿孔的研究：在第一期（1986年）中，VM工艺被应用于单个细孔的穿孔，以检查其有效性。结果表明，该工艺能够成功地在碳钢和镍箔上穿孔，这是传统剪切工艺无法实现的：例如，直径为50 m的圆孔<micrn>和宽度为50 m的狭缝。对穿孔压力进行了理论分析.对多个细孔的多重穿孔的研究：在第二学期（1987年），尝试了多个细孔的多重穿孔，作为一个更实际的问题，采用VM过程。用显微镜观察了电子铜箔穿孔的形貌，阐明了穿孔的形成机理。在有限的条件下，成功地一次加工出直径50 <micrn>m、孔距75 m的圆孔，这是常规剪切所不能做到的。此外，一种新的技术（原子力显微镜法）精密冲孔。

Recent developments in the electronics industries requre a piercing techniquefor fine holes at a high production rate. In the present project, it was attempted to apply to such piercing a new manufacturing process using a viscoplastic pressure medium (VM process), recently proposed by the head investigator. Theresults obtained are summarized as follows.1. Investigations into single fine hole piercing:In the first term (in 1986), the VM process was applied to piercing of a single fine hold in order to examine its validity. As a result, the process was shown to be successful in piercing various fine holes through carbon steel and nickel foils, unobtainable by the conventional shearing process: for example, a circular hole of 50 <micrn>m in diameter and a slit of 50 m in width. The piercing pressure was analyzed theoretically.2. Investigations into multipiercing of plural fine holes:In the second term (in 1987), multipiercing of plural fine holes was attempted as a more practical problem, employing the VM process. The appearance of the holes pierced through electronics copper foils was examined microscopically, and the mechanism of the hole formation was clarified. Though under a limited condition, the process was successful in obtaining the circular holes 50 <micrn>m in diameter and 75 (micrn)m in pitch with one shot, impossible by the conventional shearing. Furthermore, a new technique (AFM method) for precise piercing of fine holes was developed.