Transien Liquid Phase Bonding of Aluminum Alloy-Based Composites Using Thin Film as Insert Metal

一、以铜薄膜为镶嵌金属的Al_2O_3颗粒增强A6061合金基复合材料的瞬时液相连接1.Al_2O_3颗粒增强A6061合金基复合材料的瞬时液相连接以铜薄膜为最佳镶嵌金属。铜箔厚度0.5- 3.0 μ m，键合温度570 ℃，键合时间0.3ks，3.铜薄膜连接的复合材料接头的抗拉强度与母材基本相同5.Al_2O_3颗粒在基体界面处的偏析被铜薄膜所阻止。Ⅱ. SiC颗粒增强AC_3A合金基复合材料与AC_3A的铜薄膜瞬时液相连接1.接头的最大力学性能在以下条件下获得：铜箔厚度为3.0 μ m，键合温度为560 ℃，键合时间为0.6ks，键合压力为19.6MPa。

I.Transient Liquid Phase Bonding of Al_2O_3 Particle Reinforced A6061 Alloy-Based Composites Using Copper Thin Film as Insert Metal1.Copper thin film was oputimal for the insert metal of TLP bonding of the aluminum alloy based composites.2.Maximum Mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 0.5-3.0mum, bonding temperature 570ﾟC,bonding time of 0.3ks, and pressure of 1.0MPa.3.The joint of composites bonded with Cu thin film has been almost the same as the base metal in point of the tensile strength.4.Tensile strength of the joint were increased by T6 heat treatment after bonding.5.The segregation of Al_2O_3 particles at the bobd interface were prevented by using thin Cu film.II.Transient Liquid Phase Bonding of SiC Particle Reinforced AC3A Alloy-Based Composite to AC3A Using Copper Thin Film as Insert Metal1.Maximum mechanical properties of joints were obtaind by the following conditions : Cu foil thickness of 3.0mum, bonding temperature 560ﾟC,bonding time of 0.6ks, and pressure of 19.6MPa.2.Coase Si particles were segregated at the bond interface result from coexisting of Al-Cu eutectic liquid phase.