A Study on the Development of an Insert Metal for Welding

焊接用嵌件金属的研制研究

基本信息

  • 批准号:
    01460226
  • 负责人:
  • 金额:
    $ 3.78万
  • 依托单位:
  • 依托单位国家:
    日本
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)
  • 财政年份:
    1989
  • 资助国家:
    日本
  • 起止时间:
    1989 至 1990
  • 项目状态:
    已结题

项目摘要

The performance of the brazing and the diffusion bonding which have been recognized as the important primary technology in the modern high-techs depends on the characteristics and the development of an insert metal. We made study on the development of insert metal and welding process from the following three viewpoints. a) To weld more easily an active metal, its alloy and the metal having a stable oxide surface film. b) To aim the low-energy welding process (welding process at as low temperature as possible), which is taken as a final goal. c) To weld more easily and more surely metals to ceramics.The main new results obtained in this study and a present state are as follows.1) We chose a pure commercial titanium and a Ti-Ni shape memory alloy as an active metal. As for the pure Ti, Zr-based brazing filler metal of Zr-47Cu was developed to give sufficient strength and corrosion resistance to the brazed joint. Furthermore, we succeeded in the development of the fluxes and Ag-based fill … More er metals to make brazing the in-air brazing of the shape memory alloy possible.2) We made some considerations about the insert metals and the welding process for an aluminum which is a typical metal having a tight stable oxide surface film to increase the diffusion bondability and brazability. The magnesium of about 1 wt% existing in the Al base metal or the filler metal was proved to be very efficient to reduce the oxide film of aluminum and to increase the diffusion bondability. Furthermore, we tried to make the brazing or soldering in air of the aluminum. The in-air brazing of the aluminum was completed using an Zn-based filler metal and being aided with an ultrasonic wave.3) We made some kinds of rapidly solidified metal tape of Ni-base, Fe-base and Cu-base, and followed by t ing to apply their softening property exerted at lower temperature on reheating to welding process. The Cu-based rapidly soldified metal became a little softened, however, the softness was not so enough to be applied to welding.4) The brazing alumina or aluminum nitride to pure copper is being used to build up an IC package. We are presently trying to produce a cheaper and lower melting point filler metal for brazing these ceramics to pure copper. Less
钎焊和扩散连接是现代高新技术中重要的基础技术,钎焊和扩散连接的性能取决于钎料的特性及其发展。我们从以下三个角度对插片金属的发展和焊接工艺进行了研究。a)更容易焊接活性金属,其合金和金属具有稳定的氧化表面膜。b)以低能耗焊接工艺(焊接工艺温度尽可能低)为最终目标。c)将金属更容易、更可靠地焊接到陶瓷上。本研究取得的主要新成果及现状如下:1)我们选择了纯商用钛和Ti-Ni形状记忆合金作为活性金属。对于纯Ti,研制了zr基Zr-47Cu钎焊填充金属,使钎焊接头具有足够的强度和耐腐蚀性。此外,我们还成功地开发了助焊剂和银基填充剂,使形状记忆合金的空气钎焊成为可能。2)铝是一种典型的金属,具有紧密稳定的氧化表面膜,以提高扩散结合性和钎焊性,我们对插入金属和焊接工艺进行了一些考虑。在铝基体金属或填充金属中添加约1wt %的镁,可有效地降低铝的氧化膜,提高铝的扩散结合力。此外,我们尝试在空气中钎焊或焊接铝。铝的空气钎焊采用锌基填充金属,并辅以超声波。3)制作了几种快速凝固的镍基、铁基、铜基金属带,并尝试将其在低温下的再加热软化性能应用到焊接工艺中。铜基快速固化金属变得有点软化,但是,这种柔软程度不足以应用于焊接。4)将氧化铝或氮化铝钎焊到纯铜上用于构建集成电路封装。我们目前正在尝试生产一种更便宜、熔点更低的填充金属,用于将这些陶瓷钎焊到纯铜上。少

项目成果

期刊论文数量(6)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
渡辺 健彦,星野 学: "Zn基ろうによる工業用純チタンのろう付" 溶接学会論文集.
Takehiko Watanabe、Manabu Hoshino:“使用锌基钎焊对工业纯钛进行钎焊”日本焊接学会会议录。
  • DOI:
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    0
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  • 通讯作者:
渡辺 健彦,星野 学: "Zr基ろうによる工業用純チタンのろう付" 溶接学会論文集.
Takehiko Watanabe、Manabu Hoshino:“使用 Zr 基钎焊对工业纯钛进行钎焊”日本焊接学会会议录。
  • DOI:
  • 发表时间:
  • 期刊:
  • 影响因子:
    0
  • 作者:
  • 通讯作者:
Takehiko Watanabe et al: "Brazing of Commercial Pure Titanium with Zr-based Filler Metals" Journal of Japan Welding Society.
Takehiko Watanabe 等人:“Brazing of Commercial Pure Titanium with Zr-based Filling Metals”日本焊接学会杂志。
  • DOI:
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  • 期刊:
  • 影响因子:
    0
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WATANABE Takehiko其他文献

WATANABE Takehiko的其他文献

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{{ truncateString('WATANABE Takehiko', 18)}}的其他基金

Studies on Brain Histamine Neurons Using Gene-Targetted Mice
使用基因靶向小鼠进行脑组胺神经元研究
  • 批准号:
    10044229
  • 财政年份:
    1998
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A).
Regulation of histamine synthesis and degradation at the gene level
基因水平上组胺合成和降解的调控
  • 批准号:
    08044230
  • 财政年份:
    1996
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for international Scientific Research
Molecular pharmacology of histamine system
组胺系统的分子药理学
  • 批准号:
    08407005
  • 财政年份:
    1996
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Scientific Research (A)
The soldering aluminum alloys containing high amounts of Mg with aid of ultrasonic vibration
超声波振动辅助焊接高镁铝合金
  • 批准号:
    07555218
  • 财政年份:
    1995
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B)
Drug development with histamine H3 receptor as a target
以组胺H3受体为靶点的药物开发
  • 批准号:
    05557008
  • 财政年份:
    1993
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Developmental Scientific Research (B)
New perspectives in research for histaminergic functions in CNS
中枢神经系统组胺能功能研究的新视角
  • 批准号:
    05044147
  • 财政年份:
    1993
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for international Scientific Research
Histamine and learning-memory and convulsion
组胺与学习记忆和惊厥
  • 批准号:
    05454663
  • 财政年份:
    1993
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)
Histamine as a neurotransmitter: Fluorescence immunohistochemistry of its synthetic and degradative enzymes and purification of histamine receptor protein.
组胺作为神经递质:其合成酶和降解酶的荧光免疫组织化学以及组胺受体蛋白的纯化。
  • 批准号:
    59480132
  • 财政年份:
    1984
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for General Scientific Research (B)

相似海外基金

Development of simultaneous friction welding technique with low heat input for difficult materials combination with insert metal
开发低热输入同时摩擦焊接技术,用于难于与嵌入金属结合的材料
  • 批准号:
    21K03775
  • 财政年份:
    2021
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
Supporting System for Insert Metal Design used for Transient Liquid Phase Bonding
用于瞬态液相键合的插入金属设计支撑系统
  • 批准号:
    11450275
  • 财政年份:
    1999
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Scientific Research (B).
Transien Liquid Phase Bonding of Aluminum Alloy-Based Composites Using Thin Film as Insert Metal
使用薄膜作为插入金属的铝合金基复合材料的瞬态液相键合
  • 批准号:
    07650830
  • 财政年份:
    1995
  • 资助金额:
    $ 3.78万
  • 项目类别:
    Grant-in-Aid for Scientific Research (C)
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