A Study on the Development of an Insert Metal for Welding

钎焊和扩散连接是现代高新技术中重要的基础技术，钎焊和扩散连接的性能取决于钎料的特性及其发展。我们从以下三个角度对插片金属的发展和焊接工艺进行了研究。a)更容易焊接活性金属，其合金和金属具有稳定的氧化表面膜。b)以低能耗焊接工艺（焊接工艺温度尽可能低）为最终目标。c)将金属更容易、更可靠地焊接到陶瓷上。本研究取得的主要新成果及现状如下：1)我们选择了纯商用钛和Ti-Ni形状记忆合金作为活性金属。对于纯Ti，研制了zr基Zr-47Cu钎焊填充金属，使钎焊接头具有足够的强度和耐腐蚀性。此外，我们还成功地开发了助焊剂和银基填充剂，使形状记忆合金的空气钎焊成为可能。2)铝是一种典型的金属，具有紧密稳定的氧化表面膜，以提高扩散结合性和钎焊性，我们对插入金属和焊接工艺进行了一些考虑。在铝基体金属或填充金属中添加约1wt %的镁，可有效地降低铝的氧化膜，提高铝的扩散结合力。此外，我们尝试在空气中钎焊或焊接铝。铝的空气钎焊采用锌基填充金属，并辅以超声波。3)制作了几种快速凝固的镍基、铁基、铜基金属带，并尝试将其在低温下的再加热软化性能应用到焊接工艺中。铜基快速固化金属变得有点软化，但是，这种柔软程度不足以应用于焊接。4)将氧化铝或氮化铝钎焊到纯铜上用于构建集成电路封装。我们目前正在尝试生产一种更便宜、熔点更低的填充金属，用于将这些陶瓷钎焊到纯铜上。少

The performance of the brazing and the diffusion bonding which have been recognized as the important primary technology in the modern high-techs depends on the characteristics and the development of an insert metal. We made study on the development of insert metal and welding process from the following three viewpoints. a) To weld more easily an active metal, its alloy and the metal having a stable oxide surface film. b) To aim the low-energy welding process (welding process at as low temperature as possible), which is taken as a final goal. c) To weld more easily and more surely metals to ceramics.The main new results obtained in this study and a present state are as follows.1) We chose a pure commercial titanium and a Ti-Ni shape memory alloy as an active metal. As for the pure Ti, Zr-based brazing filler metal of Zr-47Cu was developed to give sufficient strength and corrosion resistance to the brazed joint. Furthermore, we succeeded in the development of the fluxes and Ag-based fill … More er metals to make brazing the in-air brazing of the shape memory alloy possible.2) We made some considerations about the insert metals and the welding process for an aluminum which is a typical metal having a tight stable oxide surface film to increase the diffusion bondability and brazability. The magnesium of about 1 wt% existing in the Al base metal or the filler metal was proved to be very efficient to reduce the oxide film of aluminum and to increase the diffusion bondability. Furthermore, we tried to make the brazing or soldering in air of the aluminum. The in-air brazing of the aluminum was completed using an Zn-based filler metal and being aided with an ultrasonic wave.3) We made some kinds of rapidly solidified metal tape of Ni-base, Fe-base and Cu-base, and followed by t ing to apply their softening property exerted at lower temperature on reheating to welding process. The Cu-based rapidly soldified metal became a little softened, however, the softness was not so enough to be applied to welding.4) The brazing alumina or aluminum nitride to pure copper is being used to build up an IC package. We are presently trying to produce a cheaper and lower melting point filler metal for brazing these ceramics to pure copper. Less