Breakthrough technologies in implantable bionics

该项目旨在通过微型化、自动化和提高可靠性引入植入式仿生学的革命性变化，并通过利用激光工艺的最新进展来产生新的知识。预期成果包括具有更多通道和携带电荷能力的创新混合薄膜/厚膜电极阵列，用于神经调节；促进深度微型化密封封装的新型玻璃接口；以及故障分析，以确保研究目标导致与当前最先进的工艺一样或更可靠的新工艺。这项工作将创造新的和新颖的制造工艺，并培训配备工具的下一代创新者，将植入式仿生学推向未来。

This project aims to introduce revolutionary changes in implantable bionics via miniaturisation, automation and improved reliability and generating new knowledge by leveraging recent advances in laser processes. Expected outcomes include innovative hybrid thin-film/thick-film electrode arrays with more channels and charge-carrying capacity for neuromodulation; novel glass interfaces that facilitate deeply-miniaturised hermetic packages; and failure analysis to ensure study aims result in new processes that are as or more reliable than the current state-of-the-art. This work will create new and novel manufacturing processes, and trains the next generation of innovators equipped with the tools to advance implantable bionics into the future.