Active Printed Circuit Boards/Three-Dimensional Micro Optical Switching Systems and Resource-Saving Device Integration Processes

为了减小盒内光互连的尺寸/成本，我们提出了“三维（3-D）堆叠光电（OE）系统LSI”和“3-D微光开关系统（3D-MOSS）”，基于以下策略：构建3-D架构，将薄膜器件嵌入波导薄膜中，形成自组织膜间光布线。我们得到的结果如下：1.3 3d - moss可以实现1024x1024光交换，系统尺寸为1.4 × 0.6 cm^2，插入损耗为29 dB，与传统平面结构相比，占用面积减少了3/100，损耗减少了14 dB。“选择性占用重复转移光刻封装（PL-Pack with SORT）”是一种资源节约的设备集成工艺，它使用全光刻工艺将不同类型的活性元素以期望的分布集成到一个衬底中，能够将嵌入功能材料的消耗降低到1/10 ~ 1/10000，从而大幅降低成本。实验验证了该工艺的概念验证。采用内嵌掩模法制备了表面法向反射镜波导薄膜。该方法将以最大的定位精度和最小的加工成本实现任意方向的细间距微反射镜波导薄膜的经济高效的批量生产。实验证明了该工艺的概念验证。为了降低光纤z形连接的制造成本，我们提出将自组织光波网络（SOLNET）应用于垂直波导的形成。光束传播方法表明，在3D-MOSS中，薄膜组件中25%的波导错位会使插入损耗高达73 dB，而SOLNET可以将其降低到31 dB。实验结果表明，SOLNET的耦合效率高，公差宽，是一种有效的三维光纤布线方法。

In order to reduce size/cost of optical interconnects within boxes, we proposed "Three-Dimensional(3-D) Stacked Optoelectronic(OE) System LSI" and "3-D Micro Optical Switching System (3D-MOSS)" based on the following strategies : constructing 3-D architecture, embedding thin-film devices into waveguide films, and forming self-organized inter-film optical wiring. We obtained results described below.1.3D-MOSS can achieve 1024x1024 optical switching with a system size of-1.4x0.6 cm^2 and insertion loss of 29 dB, which correspond to an occupation area reduction of 3/100 and loss reduction of 14 dB comparing with the conventional planar structure.2.A resource-saving device integration process "Photolithographic Packaging with Selectively-Occupied Repeated Transfer (PL-Pack with SORT)," which integrates different types of active elements into one substrate in desired distributions using all-photolithographic process, was found to be able to decrease consumption of embedded functional materials down to 1/10〜1/10000, resulting in drastic cost reduction. The proof-of-concept of the process was demonstrated experimentally.3.Waveguide films with surface-normal mirrors were fabricated by the built-in mask method. The method will realize cost-effective mass production of waveguide films with fine-pitch micro mirrors of arbitrary directions with maximized positional accuracy and with minimized processing cost. The proof-of-concept of the process was demonstrated experimentally.4.To reduce fabrication cost of optical Z-connections, we proposed to apply Self-Organized Lightwave Network(SOLNET) to the vertical waveguide formation. The beam propagation method reveals that, while 25% waveguide misalignment in film assembly raises the insertion loss up to 73 dB in 3D-MOSS, SOLNET can reduce it down to 31 dB. Experimental works demonstrated high coupling efficiencies of SOLNET with wide tolerance, indicating that SOLNET is effective for 3-D optical wiring construction.