Passive/Active Defect Monitoring Inverse Analysis Method Using Flexible Piezoelectric Smart Layer with Probe Matrix

为了保证结构的完整性，提出了基于探针矩阵柔性压电智能层的被动/主动缺陷监测逆分析方法。采用被动电势CT （computer tomography）方法，利用被动出现在压电薄膜上的电势，成功地识别出了贯通部分的三维裂纹。证明了几种压电薄膜的优点。在主动脉冲回波法中，一个探头主动发射的回波被多个探头接收。根据几种发射和接收探头组合回波的飞行时间，确定了裂纹。当两个探头发射的回波存在回波干扰时，利用回波发射时间的差异成功地进行了裂纹识别。确定了被动法和主动法同时使用的效果。

For assuring integrity of structures, the passive/active defect monitoring inverse analysis method was proposed using flexible piezoelectric smart layer with probe matrix. By the passive electric potential CT (computed tomography) method, which used electric potential appearing passively on piezoelectric film, a part-through three-dimensional crack was identified successfully. The advantage of the use of several piezoelectric films was demonstrated. In the active pulse-echo method, echo emitted actively at a probe was received at several probes. From the time-of-flight of the echo for several combinations of emitting and receiving probes, the crack was identified. When echo interference was observed for echo emitted at two probes, crack identification was made successfully from the difference of emitting time of the echo. The effect of the simultaneous use of the passive and the active methods was identified.