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Map Formation for Cold Spray Conditions Based on Particle Kinetic and Rebound Energies

Map Formation for Cold Spray Conditions Based on Particle Kinetic and Rebound Energies
基于粒子动能和反弹能的冷喷涂条件图形成
批准号:
23360317
负责人:
OGAWA Kazuhiro
金额:
$12.15万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (B)
财政年份:
2011
资助国家:
日本
项目状态:
已结题
起止时间:
2011-04-01 至 2014-03-31

项目摘要

项目成果

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中文摘要
翻译
冷喷涂技术可以利用固态金属微粒制备涂层,具有许多优点。但是,问题是CS技术并没有弄清楚颗粒的附着机理。在使用CS设备的情况下,很难理解颗粒的附着机理,因为颗粒的直径变化很大,形状不均匀的无数颗粒几乎同时撞击到基材上。在本研究中,发展了一套冷雾模拟单粒发射系统。该系统可以用一个形状和直径固定的球形颗粒进行射出和沉积。同时,用两个激光系统可以准确地估计粒子的速度。利用该系统对不同材料组合时的颗粒粘着现象和机理进行了详细的分析,并绘制了基于颗粒动能和反弹能的冷喷涂条件图。
英文摘要
The cold spray (CS) technique, which can make coatings using solid state metallic fine particles, has many advantages. But, an issue is that the CS technique has not made clear the adhesion mechanism of particles. In the case of approach using CS equipment, it was very difficult to understand the particle adhesion mechanism, because particle diameter has wide variation and uneven-shaped countless particles almost simultaneously impinge on a substrate material. In this study, a cold spray simulated single particle shot system was developed. This system can shoot and make deposition using one spherical particle with fixed shape and diameter. And at the same time, it is possible to accurately evaluate the particle velocity by two laser systems. Using this system, the particle adhesion phenomenon and mechanism on the combination of various materials was evaluated in detail, and a map for cold spray conditions based on particle kinetic and rebound energies was made.
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会议论文
コールドスプレー銅皮膜の導電性に及ぼす放電プラズマ焼結法の効果
放电等离子烧结方法对冷喷铜镀层导电性能的影响
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [K.Sato, H.Furukawa, J.Kitamura, K.Ogawa, 伊藤潔洋,小川和洋]
通讯作者: 伊藤潔洋,小川和洋
コールドスプレー法を利用した熱影響部の発生しない構造材料接合技術の開発
开发利用冷喷涂法不产生热影响区的结构材料接合技术
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [K.Sato, H.Furukawa, J.Kitamura, K.Ogawa, 伊藤潔洋,小川和洋, 許蓮花,小川和洋]
通讯作者: 許蓮花,小川和洋
Effects of Ce Additions to Bond Coat Material on Interfacial Strength of Thermal Barrier Coatings
粘结层材料中添加 Ce 对热障涂层界面强度的影响
DOI: --
发表时间:
期刊:
影响因子: --
作者: [K.Ogawa, S.Onchi (K.Ogawa), 小川和洋 (小川和洋), K.Ogawa (K.Ogawa)]
通讯作者: K.Ogawa (K.Ogawa)
DOI: --
发表时间: 2013
期刊:
影响因子: --
作者: [小川和洋, A.Manap]
通讯作者: A.Manap
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