PATTERN: Next generation ultra-high-speed microwave Photonic integrATed circuiTs using advancE hybRid iNtegration

PATTERN将提供世界上第一个用于100 GHz以上超高频微波光子学的工艺设计套件（PDK），并将磁光隔离器和声光调制器（AOM）等新功能引入PIC。PATTERN的超高频方法是整体的，包括所有方面，如设计和仿真、生成、厌恶、调制和封装。为了实现这一目标，我们提出了几种不同PIC平台（如InP和LNOI）的大规模混合集成，但也包括钇铁石榴石（YIG）等新材料。我们还开发了电子SiGe芯片与PICs的协整，这在超高速中是非常必要的。LNOI是最有前途的PICs新兴材料之一，它具有一系列独特的光学特性：高电光系数，高固有二阶非线性和大透明窗口，使其成为许多波长（EO调制）光的电子操纵的理想选择。InP是产生和探测光的理想平台，YIG是一种已知的磁光学材料。如果把它们放在一起，就会出现真正新颖、先进的功能和机会。此外，在PATTERN中，我们开发了包装解决方案，并针对这一领域的主要障碍之一的高频率。此外，我们还为设计自动化（例如RF信号路由）和端到端电路仿真和设计开发软件专业知识，这在这些频率下极具挑战性。我们还在6个不同的面向应用程序的原型中演示了该平台的功能。为了实现这些目标，PATTERN汇集了10家知名中小企业、rto和工业企业的专业知识，在48个月的项目中实现了这些目标。一旦开发成功，PATTERN将为新一代先进的PIC产品铺平道路，这些产品将广泛应用于电信、5G/6G、量子技术、激光雷达和传感等领域。

In PATTERN will world’s first process design kit (PDK) for microwave photonics at ultra-high frequencies above 100 GHz as well as bringing new functionalities into PIC such as magneto-optics isolators and acousto optics modulators (AOM). PATTERN’s approach to ultra-high frequencies is holistic and includes all the aspects such as design and simulation, generation, detestation, modulation, and packaging. To achieve this goal, we propose a massive hybrid integration of several different PIC platforms such as InP and LNOI but also including new materials such as Yttrium Iron Garnet (YIG). We also develop co-integration of electronic SiGe chips with PICs which especially a necessity in ultra-high speeds. LNOI is of the most promising emerging materials for PICs that comprises a unique set of interesting optical properties: a high electo-optic coefficient, a high intrinsic 2nd-order nonlinearity, and a large transparency window which makes it ideal for electronics manipulation of light at many wavelengths (EO modulation). InP is an ideal platform for generation and detection of light and YIG is a known magneto-optics material. If put together, truly novel, and advanced functionalities and opportunities arise. In addition, in PATTERN we developed packaging solutions and for such high frequencies which one of the main barriers in this field. Moreover, we also develop software expertise for design automation (e.g. RF signal routing) and end-to-end circuit simulation and design which is extremely challenging at these frequencies. We also demonstrate the capabilities of the platform in 6 different application-oriented prototypes. To achieve these objectives, PATTERN put together the expertise of 10 well know SMEs, RTOs and industrial players to achieve these objectives in 48 months project. Once developed, PATTERN will pave the way for the new generation of advanced PIC products in wide range of applications from telecom, 5G/6G to quantum technologies, LiDAR and sensing.