SINES (SINtering of Embedded Semiconductors)

RAM Innovations设计和制造高功率密度电力电子模块。这种世界领先的功率密度是通过将裸芯片GaN和SiC功率器件直接嵌入印刷电路板实现的。RAM正在投资于其制造工艺和设备，以满足对高功率密度电子产品日益增长的需求，这对于支持通过运输和其他行业的电气化向净零过渡至关重要。西内斯项目（嵌入式半导体烧结）专注于确保RAM能够获得最新的烧结技术，以实现高吞吐量，高产量和具有成本效益的批量制造工艺。

RAM Innovations designs and manufactures high power density power electronics modules. This world leading power density is achieved through the embedding of bare die GaN and SiC power devices directly into printed circuit boards. RAM is investing in its manufacturing processes and equipment to enable it meet the growing demand for high power density electronics, critical to support the transition to Net-Zero through the electrification of transport and other industries.Project SINES (SINtering of Embedded Semiconductors) is focused on ensuring RAM has access to the latest Sintering technology to enable a high throughput, high yield and cost-effective volume manufacturing process.