"Ultra-Sleeve" - Advanced protective encapsulation for commercial-of-the-shelf semiconductor chips in extreme environments

Ultra-Sleeve是一项可行性研究，旨在设计、制造和评估一种基于金刚石和相关材料的封装解决方案，用于保护极端环境下网络物理系统中使用的商用现货（COTS）半导体组件。该项目的最初重点是证明机器人和自动系统中常见的车载电子设备的概念。该项目将由先进制造业激光加工技术的领先中小企业Advancete Limited领导。在项目实施过程中，我们还将研究更广泛的市场领域的机会，并为该技术的未来发展和商业化制定明确的商业路线图。在整个项目中，我们将得到主要行业参与者的支持。

Ultra-Sleeve is a feasibility study to design, manufacture and evaluate an encapsulation solution based on diamond and related materials for protecting commercial off-the-shelf (COTS) semiconductor components used in cyber-physical systems for extreme environments. The initial focus of the project is targeted at proving the concept for on-board electronics that are commonly found in robotic and autonomous systems. The project will be led by Advancete Limited, a leading SME in laser processing techniques for advanced manufacturing. During the course of the project we will also look at the opportunities within the wider market sectors and produce a clear commercial roadmap for the future development and commercialisation of the technology. Throughout the project we will be supported by key industry players.