Next generation flexible high current micro-electronic interconnects

该项目旨在通过使用低熔点金属镓基合金来降低制造电子电路所需的温度。该项目将使用一系列创新技术来生成这些低温合金可以在低温下在短时间内从液态快速转变为固态金属间化合物的方法。该项目的成果包括降低电子制造过程中的能源成本，以及开发技术，使敏感的下一代组件能够通过消除使用高温的需要来组装。

The project aims to reduce the temperatures required for the manufacture of electronic circuitry through the use of low melting temperature metallic gallium-based alloys. The project will use a range of innovative techniques to generate methods that these low temperature alloys can rapidly transition from a liquid state to a solid intermetallic in short timeframes at low-temperatures. The outcomes from this project include reduced energy costs during electronic manufacture and the development of techniques that will enable sensitive next-generation components to be assembled by removing the need to use elevated temperatures.