Development of a Miniature Refrigeration System for Electronics Cooling

该应用程序是由三个具有传热，系统仿真和组件设计专业知识的团队在具有重大工业和社会意义的冷却领域进行合作研究。该项目的领导团队将设在纽卡斯尔大学，支持团队将设在牛津大学和南岸大学。如果电子芯片的性能按照目前的趋势，每18个月翻一番（摩尔定律），那么使用传统的被动冷却技术很快就不可能有效地冷却它们，必须找到一种替代技术/设备。特别是，它涉及到的理论分析和实验评估的微型蒸汽压缩制冷循环优化冷却未来的电子系统。拟议的工作将包括三项不同但相互关联的活动，将在三个中心由具有从事这项工作的公认技能、专门知识、资源和经验的人员进行。拟议的工作是创新的，因为它将研究迄今尚未研究的微型制冷系统相关的问题。其目的是探索与系统稳定性相关的设计标准，并制定设计规范，以帮助此类系统的设计人员和制造商。多孔材料相变的传热性能以及与压缩机开发相关的技术转移都有助于使这成为一个非常创新的项目。这两个小组已经有了合作的经验，将作出安排，促进更大规模的意见和专门知识交流。与三个互不关联的项目相比，这种集成方法将具有显著的优势，并在电子冷却技术方面迈出了重要的一步。这项工作将得到几个工业合作伙伴和合作者的支持，即Thermacore，Panasonic和Honeywell，他们都将为该项目提供技术和实物资源。已获得松下、Thermacore、霍尼韦尔-海迈特和Hexag的支持信。

This application is for collaborative research on an area of cooling of great industrial and social significance by three teams with expertise in heat transfer, system simulation and component design. The lead team will be based at Newcastle University with the support teams at Oxford and South Bank UniversitiesIf the performance of electronic chips follow current trends and double every 18 months (Moore's Law), then it will soon not be possible to effectively cool them using conventional passive cooling and an alternative technique/devices must be found. This proposal is concerned with developing such a device. In particular it is concerned with a theoretical analysis and experimental evaluation of a miniature vapour compression refrigeration cycle optimised for the cooling of future electronic systems. The proposed work will consist of three distinct but interrelated activities that will be conducted at three centres by personnel with recognised skills, expertise, resources and experience to undertake this work. The proposed work is innovative in that it will examine issues associated with miniature refrigeration systems that have not been studied hitherto. It is intended to explore design criteria related to system stability and develop design codes to assist designers and manufacturers of such systems. The heat transfer performance of phase change in porous materials and the technology transfer associated with the compressor development all contribute to making this a very innovative project. The groups already have experience of working together and arrangements will be put in place to facilitate the exchange of ideas and expertise on a larger scale. The integrated approach will provide significant advantages compared to three unlinked projects and produce a significant step forward in electronic cooling technology. The work will be supported by several industrial partners and collaborators namely Thermacore, Panasonic and Honeywell who will all contribute technical and in kind resources to the project. Letters of support have been obtained from Panasonic, Thermacore, Honeywell-Hymatic and Hexag.