All-Evaporated Triple-Junction Perovskite Photovoltaic Devices

随着技术的进步，无人驾驶飞行器（UAV）和卫星已广泛用于各种应用，如物流，农业，医疗保健，军事和科学工作。无人机目前依靠电池技术为机载计算机和全球定位卫星系统提供动力，以进行长距离和短距离飞行。例如，英国政府最近向英国卫星公司OneWeb投资了5亿英镑，这表明英国大力推动开发具有新型通信技术的低成本卫星。无人机和卫星越来越需要具有成本效益的新型电源，以维持和延长无人机和卫星的运行时间。增加辅助部件和再充电能量存储系统。高功率重量比的光伏器件可以满足这些新型电子器件的需求。金属卤化物钙钛矿太阳能电池现在已经实现了25.5%的功率转换效率（PCE），使其成为领先的新兴薄膜光伏材料。与许多其他新兴的光伏材料不同，具有宽禁带范围的高质量钙钛矿薄膜可以在低温下在各种衬底上制造。该研究项目的目的是开创一种具有高功率重量比的30%PCE三结钙钛矿太阳能电池。目前开发钙钛矿多结光致发光材料的限制主要是基于溶液处理的限制。物理气相沉积（PVD），特别是热蒸发，是一种干法工艺，它产生均匀的钙钛矿薄膜，不需要溶剂，可扩展，广泛用于工业中制造各种大型电子产品。这个EPSRC博士后奖学金提案提出了一个开发全蒸发30%三结钙钛矿光伏器件的计划。最初，我将在研究PVD室中开发每个子电池，并找到理想的蒸发速率，以创建高质量的钙钛矿薄膜和电荷传输层。然后，我将把这些参数转移到新的国家薄膜集群设施先进功能材料，这是由牛津物理主办，在那里我将能够制造每个子电池，并将它们联合收割机，在真空中，创造一个三结钙钛矿太阳能电池。在开发钙钛矿薄膜的同时，我将仔细监测和阐明具有不同成分的钙钛矿薄膜的晶体生长机制，并提供一个关于蒸发具有出色光电质量的钙钛矿薄膜的要求的整体蓝图。将开发三个子电池，每个子电池仅使用无溶剂沉积技术制造，如PVD，原子层沉积和溅射，并将妥协的p-i-n异质结架构。然后，每个子电池将与国家先进功能材料薄膜集群设施的透明导电氧化物复合层电连接，以形成最终完成的器件。三结器件将采用气相沉积技术，用工业封装材料进行封装，用于保护微芯片和电子产品。最后，将进行一系列器械稳定性实验，以确定模拟降雨、光照、温度和化学品暴露对器械的影响。

With the advancement of technology, unmanned aerial vehicles (UAV) and satellites have become widely accessible for a variety of applications, such as logistics, agriculture, healthcare, military, and scientific endeavours. UAVs currently rely on battery technology to power onboard computers and global positioning satellite systems for long- and short-range flights. For example, the recent investment of £500 million by the UK government in the British satellite company, OneWeb, indicates a significant push towards developing low-cost satellites with novel communications technologies.To meet the required specifications for different purposes, UAVs and satellites increasingly need cost-effective novel sources of power to maintain and extend the running time of ever-increasing auxiliary components and recharge energy storage systems. High power-to-weight photovoltaic devices can meet the needs of these new classes of electronic devices. Metal halide perovskite solar cells have now achieved power conversion efficiencies (PCE) of 25.5%, making them the leading emerging thin film photovoltaic material. Unlike many other emerging photovoltaic materials, high quality perovskite films of a wide range of bandgaps can be fabricated at low temperature on a variety of substrates. The aim of this research project is to pioneer a 30% PCE triple-junction perovskite solar cell with a high power-to-weight ratio. The current limitations in developing perovskite multi-junction photovoltaics are predominantly based on the limitations of solution processing. Physical vapour deposition (PVD), specifically thermal evaporation, is a dry process, which produces uniform perovskite films and does not require solvents, is scalable and is widely used in industry to fabricate a variety of large-scale electronics. This EPSRC Postdoctoral Fellowship proposal sets out a plan to develop an all-evaporated 30% triple-junction perovskite photovoltaic device. Initially I will develop each subcell in a research PVD chamber and find the ideal evaporation rates to create a high-quality perovskite thin film and charge transport layers. I will then transfer these parameters to the new National Thin Film Cluster Facility for Advanced Functional Materials, which is hosted by Oxford Physics, where I will be able to fabricate each subcell, and combine them, in vacuum, to create a triple junction perovskite solar cell. Whilst developing the perovskite thin films, I will carefully monitor and elucidate the crystal growth mechanism of perovskite thin films with varying compositions and deliver a holistic blueprint on requirements to evaporate perovskite thin films of outstanding optoelectronic quality. Three subcells will be developed, with each subcell fabricated using only solvent-free deposition techniques, such as PVD, atomic layer deposition and sputtering and will compromise a p-i-n heterojunction architecture. Each subcell will then be electrically connected with a transparent conductive oxide recombination layer at the National Thin Film Cluster Facility for Advanced Functional Materials to form the final completed device. The triple-junction devices will be encapsulated using vapour deposition with an industrial encapsulant material used to protect microchips and electronics. Finally, a series of device stability experiments will be undertaken to determine effect of simulated rain, light, temperature, and chemical exposure on the device.