All-Evaporated Triple-Junction Perovskite Photovoltaic Devices

随着技术的进步，无人驾驶飞行器（UAV）和卫星已经广泛用于各种应用，例如物流，农业，医疗保健，军事和科学研究。无人机目前依靠电池技术为机载计算机和全球定位卫星系统提供动力，用于远程和短程飞行。例如，英国政府最近向英国卫星公司OneWeb投资了5亿英镑，这表明英国政府大力推动开发具有新型通信技术的低成本卫星。为了满足不同用途所需的规格，无人机和卫星越来越需要具有成本效益的新型电源来维持和延长不断增加的辅助部件和充电储能系统的运行时间。高功率重量比光伏器件可以满足这些新型电子器件的需求。金属卤化物钙钛矿太阳能电池现已达到25.5%的功率转换效率（PCE），使其成为领先的新兴薄膜光伏材料。与许多其他新兴的光伏材料不同，高质量的钙钛矿薄膜可以在低温下在各种衬底上制造出广泛的带隙。该研究项目的目标是开发具有高功率重量比的30% PCE三结钙钛矿太阳能电池。目前发展钙钛矿多结光伏的限制主要是基于溶液处理的限制。物理气相沉积（PVD），特别是热蒸发，是一种干燥工艺，可以产生均匀的钙钛矿薄膜，不需要溶剂，可扩展，广泛用于工业制造各种大型电子产品。这项EPSRC博士后奖学金提案提出了一项开发全蒸发30%三结钙钛矿光伏器件的计划。最初，我将在研究PVD室中开发每个子电池，并找到理想的蒸发速率，以创建高质量的钙钛矿薄膜和电荷传输层。然后，我将把这些参数转移到由牛津物理学院主办的新的国家先进功能材料薄膜集群设施，在那里我将能够制造每个子电池，并将它们在真空中组合起来，以创建三结钙钛矿太阳能电池。在开发钙钛矿薄膜的同时，我将仔细监测和阐明不同成分钙钛矿薄膜的晶体生长机制，并就蒸发具有优异光电质量的钙钛矿薄膜的要求提供全面的蓝图。将开发三个子电池，每个子电池仅使用无溶剂沉积技术（如PVD，原子层沉积和溅射）制造，并将损害p-i-n异质结结构。然后，每个子电池将与国家先进功能材料薄膜团簇设施的透明导电氧化物复合层电连接，以形成最终完成的设备。三结器件将采用气相沉积封装，采用工业封装材料，用于保护微芯片和电子设备。最后，将进行一系列的器件稳定性实验，以确定模拟雨、光、温度和化学物质暴露对器件的影响。

With the advancement of technology, unmanned aerial vehicles (UAV) and satellites have become widely accessible for a variety of applications, such as logistics, agriculture, healthcare, military, and scientific endeavours. UAVs currently rely on battery technology to power onboard computers and global positioning satellite systems for long- and short-range flights. For example, the recent investment of £500 million by the UK government in the British satellite company, OneWeb, indicates a significant push towards developing low-cost satellites with novel communications technologies.To meet the required specifications for different purposes, UAVs and satellites increasingly need cost-effective novel sources of power to maintain and extend the running time of ever-increasing auxiliary components and recharge energy storage systems. High power-to-weight photovoltaic devices can meet the needs of these new classes of electronic devices. Metal halide perovskite solar cells have now achieved power conversion efficiencies (PCE) of 25.5%, making them the leading emerging thin film photovoltaic material. Unlike many other emerging photovoltaic materials, high quality perovskite films of a wide range of bandgaps can be fabricated at low temperature on a variety of substrates. The aim of this research project is to pioneer a 30% PCE triple-junction perovskite solar cell with a high power-to-weight ratio. The current limitations in developing perovskite multi-junction photovoltaics are predominantly based on the limitations of solution processing. Physical vapour deposition (PVD), specifically thermal evaporation, is a dry process, which produces uniform perovskite films and does not require solvents, is scalable and is widely used in industry to fabricate a variety of large-scale electronics. This EPSRC Postdoctoral Fellowship proposal sets out a plan to develop an all-evaporated 30% triple-junction perovskite photovoltaic device. Initially I will develop each subcell in a research PVD chamber and find the ideal evaporation rates to create a high-quality perovskite thin film and charge transport layers. I will then transfer these parameters to the new National Thin Film Cluster Facility for Advanced Functional Materials, which is hosted by Oxford Physics, where I will be able to fabricate each subcell, and combine them, in vacuum, to create a triple junction perovskite solar cell. Whilst developing the perovskite thin films, I will carefully monitor and elucidate the crystal growth mechanism of perovskite thin films with varying compositions and deliver a holistic blueprint on requirements to evaporate perovskite thin films of outstanding optoelectronic quality. Three subcells will be developed, with each subcell fabricated using only solvent-free deposition techniques, such as PVD, atomic layer deposition and sputtering and will compromise a p-i-n heterojunction architecture. Each subcell will then be electrically connected with a transparent conductive oxide recombination layer at the National Thin Film Cluster Facility for Advanced Functional Materials to form the final completed device. The triple-junction devices will be encapsulated using vapour deposition with an industrial encapsulant material used to protect microchips and electronics. Finally, a series of device stability experiments will be undertaken to determine effect of simulated rain, light, temperature, and chemical exposure on the device.