Understanding failure mechanisms in micro-solder joints in three dimensional integrated circuit packaging

用于微电子设备的高密度三维集成电路正在发展，并对微焊点提出了越来越高的要求。锡基无铅焊料合金需要进一步开发以满足性能要求，特别是在焊料和衬底之间的金属间化合物形式的性能方面。本项目利用微柱压缩和超高压电子显微镜研究了添加了微量元素的金属间化合物的力学性能和变形机制。除了开发可转移到类似研究的技术外，该项目还将带来与焊料成分相关的重大知识产权。

High-density three-dimensional integrated circuits used in microelectronic devices are evolving and placing increasing demands on micro-solder joints. Tin based lead-free solder alloys require further development to satisfy performance requirements, particularly with respect to the properties of the intermetallic forms between solder and substrate. This project investigates the mechanical properties and deformation mechanisms of intermetallic forms with trace element additions using micro-pillar compression and ultra-high voltage transmission electron microscopy. Beyond the development of techniques transferable to similar research, this project will lead to significant intellectual property relating to solder composition.