High Performance Flexible Electronics by Printed Micro/Nanostructures

本项目旨在探索和控制用于大面积柔性电子产品的各种基板上的NW印刷工艺。在执行该项目的同时，候选人预计将获得各种技术来修改接收器基板的表面特性，然后从实验和理论上研究在其上的印刷过程。之后，印刷的NW层将用于实现电子器件，特别是场效应晶体管（FET）。我们将研究控制印刷场效应晶体管特性的策略，例如阈值电压和通态电流，这将最终导致具有受控性能的大面积印刷场效应晶体管。该项目将使用接触印刷方法将纳米线转移到柔性基板上的电子层，并从中开发电子设备和电路。将分析技术方面的比较，如在柔性基底上的粘附力、机械性能和印刷精度，以及使用机械测试进行的电阻系统测量。从柔性衬底的选择、存款温度、溶剂的选择和后处理等几个方面进行了讨论。

This project aims to explore and control the NW printing process on various substrates for large-area flexible electronics. Whilst carrying out the project, the candidate is expected to acquire various techniques to modify the surface properties of the receiver substrates and then study the printing process onto them both experimentally and theoretically. Afterwards, the printed NW layers will be used for realizing electronic devices, especially field-effect transistors (FETs). Strategies will be investigated to control the characteristics of the printed FETs such as threshold voltage and on-state current, which will finally lead to a large-area printed FETs with controlled performance. This project will use the contact printing method for transferring nanowires to electronic layers onto flexible substrates and develop electronic devices and circuits from them. Comparisons on technological aspects like adhesion on flexible substrates, mechanical properties and printing accuracy and Systematic measurements of resistance using mechanical testing will be analyzed. Several aspects will be considered including choice of the flexible substrate, deposit temperature, choice of the solvent and post treatment.