Scanning vibrometer for 3D MEMS dynamic characterization

该提案要求资助购买激光多普勒振动测量（LDV）系统，该系统具有表征3D微/纳米机电系统（MEMS/NEMS）高频动态的能力。我们小组和阿尔伯塔大学的几个研究项目将利用所要求的设备，包括利用老化的生物医学、机械、航空航天、民用或环境系统周围的环境振动来动态表征基于MEMS/NEMS的能量收集设备。我们的团队参与了许多其他项目，包括高共振频率的MEMS/NEMS执行器，例如结构改进的射频开关，以减少高频（20 MHz）的集肤效应。激光多普勒振动测量是一种被广泛接受的MEMS/NEMS动态表征工具。利用自动扫描功能，LDV可以测量结构共振并显示面外偏转形状，其振幅低至皮米级，频率低至30 MHz。该LDV目前被用于整个MEMS/NEMS社区，以表征光学开关，振动悬臂，膜，致动器，电机，微光学和扭转振荡器等微器件的动力学特性。激光振动测量的应用包括：(1)对器件响应进行动态测试，以确定谐振频率、刚度和阻尼等机械参数；(2)在设计开发和发布过程中对器件响应进行表征；(3)验证设计性能与预期有限元模型预测的对比；(4)确定在机械激励（金属键合、环境振动和冲击）、辐射、温度下的可靠性；(5)校准执行器和传感器位移与驱动电压在大范围内的运动，低至纳米尺度。

This proposal request funding for purchasing of Laser Doppler Vibrometry (LDV) system that has the capability of characterizing the 3D Micro/NANO Electro Mechanical Systems (MEMS/NEMS) dynamics at high frequency. Several research projects in our group and the University of Alberta will utilize the requested equipments including, dynamic characterization of energy harvesting MEMS/NEMS based devices using ambient vibrations surrounding an aging biomedical, and mechanical, aerospace, civil or environmental system. Our group is involved in a number of other projects that include MEMS/NEMS actuators at high resonance frequency, such as structurally modified Radio Frequency switch toward the reduction of skin effect at high frequency (20 MHz). Laser Doppler Vibrometry is a widely accepted tool for dynamic characterization of MEMS/NEMS. Using automated scan capability, LDV can measure structural resonance and display out-of-plane deflection shapes with amplitudes down to the picometer level and frequencies to 30 MHz. This LDV is presently being used throughout the MEMS/NEMS community to characterize the dynamics of micro-devices such as optical switches, vibrating cantilevers, membranes, actuators, motors, micro-optics and torsional oscillators. Applications for Laser Vibrometry measurements include: (1) Dynamic testing of device response to determine mechanical parameters such as resonant frequency, stiffness and damping, (2) Characterization of device response during design development and release processes, (3) Validate design performance versus expected FEA model predictions, (4) Determine reliability under mechanical excitation (wire bonding, environmental vibration and shock), radiation, temperature, humidity and pressure stress by targeting device inside environmental or vacuum chamber and (5) Calibrate actuator and sensor displacements versus drive voltage over wide range of movements down to nano meter scale.