Hybrid parallel adaptive finite element analysis and design for high-speed microelectronic system interconnections

该研究计划的目标是开发新的，高度创新的，准确和可靠的数值方法，用于高速微电子系统互连（MSI）的有效模拟。基于电路理论的仿真已经有效地用于验证在由诸如逻辑门和晶体管的组成器件确定的最大速度下操作的系统中的信号完整性。然而，随着当今特征尺寸的缩小和时钟频率的增加，许多高速微电子系统设计的限制因素是互连延迟而不是器件切换速度。此外，诸如反射、串扰、色散和衰减之类的互连效应现在是信号损坏的主要来源，并且是在较高操作速度下系统性能退化的重要原因。标准电路分析和传统的模拟技术是不足以准确地预测微电子系统的性能时，这些条件占上风。如今，MSI研究的最新发展在于开发创新的数值方法，这些方法能够准确、有效和可靠地模拟现代高速微电子系统复杂的3-D微制造结构中的互连电磁波形。此外，当这些信息被有效地产生时，它可以通过显着减少设计过程的总时间和成本来产生重大影响。

The objective of this research program is to develop new, highly innovative, accurate and reliable numerical methods for the efficient simulation of high-speed microelectronic system interconnections (MSI). Simulations based on circuit theory have been effective for verifying signal integrity in systems operating at maximal speeds determined by constituent devices such as logic gates and transistors. However, with today's shrinking feature sizes and increasing clock frequencies, a limiting factor for many high-speed microelectronic system designs is interconnection delays rather than device switching speeds. Further, interconnection effects such as reflection, cross-talk, dispersion and attenuation are now leading sources of signal corruption and a significant cause of system performance degradation at higher operating speeds. Standard circuit analysis and conventional simulation techniques are not sufficient for accurately predicting microelectronic system performance when these conditions prevail. Today, the state-of-the-art in MSI research lies in the development of innovative numerical methods capable of accurately, efficiently and reliably simulating the interconnection electromagnetic waveforms within the sophisticated 3-D micro-fabricated structures of modern high-speed microelectronic systems. Moreover, when this information is produced effectively it can have a major impact by significantly reducing the overall time and cost of the design process.