Millimeter and submillimeter wave ultra wideband interferometry for high-resolution 3D imaging techniques and applications

由于最近的技术突破，毫米波成像传感器系统甚至在低能见度条件下（例如，雾、云、雪、沙尘暴和烟雾），这将使视觉和红外（IR）传感器失明。毫米波图像可以为飞机提供额外的着陆信息，并且可以在恶劣环境中用于机器人引导，在工业过程中用于控制和缺陷检测，或者在诊断医学中用于癌症的早期检测。 热门话题是安全和监视应用，以识别隐藏在衣服下的武器和物体检测，如塑料和陶瓷，这是传统磁力计无法检测到的。 目前的商用成像系统一般工作在35 GHz以下，集成度相对较低。W波段对当前的研究特别有意义，因为大量的频谱空间（85 - 94 GHz）已被分配用于图像应用。此外，集成电路制造的未来发展将允许将工作频率扩展到140 GHz、220 GHz、300 - 340 GHz以及更高，从而提高捕获的图像分辨率。 拟议项目的目标是为毫米/亚毫米波3D成像开发创新的架构和技术解决方案：创新电路和模块的设计，制造和表征，包括多端口干涉仪和阵列天线，新发射机和接收机架构的验证，以及信号和图像处理领域新算法的实施。将使用衬底集成电路技术，以获得成本和质量方面的最佳方法。此外，系统原型将使用最先进的测试台进行实施和测试。 该项目产生的新知识以及对与该工作不同阶段有关的高素质人员的培训，必将有助于提高加拿大在这一高技术部门的全球竞争力。

Made possible by recent technological breakthroughs, millimeter wave imaging sensor systems can provide visual-like images of objects even under low visibility conditions (e.g., fog, clouds, snow, sandstorms, and smoke), that would blind visual and infrared (IR) sensors. Millimeter wave imagery can provide additional landing information for aircrafts and can be very useful for robot guidance in adverse environments, in industrial processes for control and defect detection, or in diagnostic medicine for early detection of cancer. Hot topics are the security and surveillance applications to identify weapons hidden under the clothing and for object detection, such as plastics and ceramics, which are not detected by conventional magnetometers. Today's commercial imaging systems operate generally up to 35 GHz and the degree of integration is relatively low. The W-band is especially of interest for current research because a massive amount of spectral space (85 - 94 GHz) has been allocated for imagery applications. In addition, future developments in integrated circuit fabrication will allow extending the operating frequency to 140 GHz, 220 GHz, 300 - 340 GHz, and beyond, increasing the captured image resolution. The objective of the proposed project is to develop innovative architectural and technological solutions for millimeter/submillimeter wave 3D imagery: the design, fabrication and characterization of innovative circuits and modules, including multi-port interferometers and array antennas, validation of new transmitter and receiver architectures, and implementation of new algorithms in signal and image processing domain. Substrate Integrated Circuit technologies will be used in order to obtain an optimal approach in terms of cost and quality. Furthermore, system prototypes will be implemented and tested using state-of-the-art test-benches. The new knowledge emerged from this project and the training of highly qualified personnel associated to the different stages of this work, will certainly contribute to enhance Canada's global competitiveness in this high-technology sector.