Toward a New Generation of Additively Manufactured Heat Exchange Technologies

该发现研究计划的愿景是开发新一代传热技术，利用高性能聚合物复合材料（PC）和增材制造（AM）的最新科学和技术进步。这将使创建和优化一个全新的轻量级，高性能，两相热虹吸管，热管和热交换器。* AM与PC在热传递应用中的结合为利用高导电性PC提供的特殊材料特性和AM提供的独特制造可能性提供了一个令人兴奋的机会。然而，在这些新材料和制造方法的开发与对其相关热物理的基本理解之间存在明显的差距。该计划的长期目标是对增材制造聚合物复合材料（AM-PC）固体和结构中的热传输机制有一个基本的了解。未来5年的短期目标是：*1。表征AM-PC结构的有效热导率，并建立预测其力学和热行为的理论模型。*2。了解和控制AM-PC表面几何形状的特性，以预测和减轻接触热阻，并了解AM-PC之间的工作流体-表面相互作用，因为它们适用于两相热交换器。3.表征AM-PC表面上的沸腾传热，并开发预测模型沿着新的沸腾增强技术，这些技术是AM提供的材料和制造可能性所独有的。* 该研究计划将是多学科的，并将联合收割机热流体科学、材料表征和AM结合起来用于传热应用。 它将产生与AM-PC相关的重要传热机制和现象的全面理解，并有助于开发新一代紧凑，高性能和轻质的热传输，交换和转换技术，以满足加拿大工业的需求，如汽车，航空航天，电信和移动的设备。对于这些行业，必须在所有部件（包括热交换器）的严格重量限制下实现热目标。重量轻的两相AM-PC热交换器为极其紧迫的问题提供了创新的解决方案。*该计划还将为加拿大的高科技产业培养和发展急需的高素质人才。

The vision for this Discovery Research Program is to enable the development of a new generation of heat transfer technologies which leverages the recent scientific and technical advances in both high-performance polymer composites (PCs) and additive manufacturing (AM). This will enable the creation and optimization of an entirely new class of lightweight, high performance, two-phase thermosyphons, heat pipes, and heat exchangers. *** The combination of AM with PCs for heat transfer applications presents an exciting opportunity to leverage the potential of both the exceptional material properties offered by high conductivity PCs and the unique fabrication possibilities offered by AM. However, there is a distinct gap between the development of these new materials and fabrication methods and a fundamental understanding of their associated thermal physics.*** This program's long-term goal is to develop a fundamental understanding of thermal transport mechanisms in and on additively manufactured polymer composite (AM-PC) solids and structures. The short-term objectives that will be addressed in the next 5 years are:***1. To characterize the effective thermal conductivity of AM-PC structures and to develop theoretical models for predicting their mechanical and thermal behaviour. ***2. To understand and control the characteristics of AM-PC surface geometries for the prediction and mitigation of thermal contact resistance and to understand working fluid-surface interactions between AM-PCs as they pertain to their use in two-phase heat exchangers.***3. To characterize boiling heat transfer on AM-PC surfaces and develop predictive models along with novel boiling enhancement techniques that are unique to the materials and fabrication possibilities afforded by AM. *** This research program will be multidisciplinary and will combine thermal fluid sciences, materials characterization, and AM for heat transfer applications. It will yield a comprehensive understanding of the important heat transfer mechanisms and phenomena associated with AM-PCs and help enable the development of a new generation of compact, high-performance, and lightweight heat transport, exchange, and conversion technologies to meet the needs of Canadian industries such as automotive, aerospace, telecoms, and mobile devices. For these industries, thermal targets must be achieved with severe weight constraints on all parts, including heat exchangers. Lightweight, two-phase AM-PC heat exchangers offer an innovative solution to an extremely pressing problem.*** This program will also train and develop much-needed highly qualified personnel (HQP) for Canada's high-tech industries.